C2012X7R1E225M TDK Corporation, C2012X7R1E225M Datasheet

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C2012X7R1E225M

Manufacturer Part Number
C2012X7R1E225M
Description
CAP CER 2.2UF 25V 20% X7R 0805
Manufacturer
TDK Corporation
Series
Cr

Specifications of C2012X7R1E225M

Capacitance
2.2µF
Voltage - Rated
25V
Tolerance
±20%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Ratings
-
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Height - Seated (max)
-
Thickness (max)
0.057" (1.45mm)
Lead Spacing
-
Features
-
Lead Style
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-7570-2
SPECIFICATION FOR
TDK MULTILAYER CERAMIC CHIP CAPACITORS
Please return this specification to TDK representatives with your signature.
If orders are placed without returned specification, please allow us to judge that specification is accepted by your side.
TDK ITEM
C0603, C1005, C1608, C2012, C3216, C3225, C4532, C5750 Type / 6.3V to 630V
C0G, X5R, X7R, Y5V Characteristics
NAME OF COMPANY
TDK ENGINEERING SIGNATURE
DRAWN BY
DATE
NAME OF COMPANY
CUSTOMER RESPONSE
Please check one of three conditions below.
□ Approval
□ Approval with the following changes
□ Reject with the following reasons
TDK CORPORATION
13-1,Nihonbashi 1-chome,Chuo-ku,Tokyo 103-8272,Japan
Phone:Tokyo(03)3278-5111
CHECKED BY
DATE
SIGNATURE
APPROVED BY
DATE
DWG. NO.
DATE ISSUED
DATE
REV 0.1 / 200903

Related parts for C2012X7R1E225M

C2012X7R1E225M Summary of contents

Page 1

... If orders are placed without returned specification, please allow us to judge that specification is accepted by your side. CUSTOMER RESPONSE Please check one of three conditions below. □ Approval □ Approval with the following changes □ Reject with the following reasons NAME OF COMPANY TDK CORPORATION 13-1,Nihonbashi 1-chome,Chuo-ku,Tokyo 103-8272,Japan Phone:Tokyo(03)3278-5111 CHECKED BY DATE SIGNATURE DWG. NO. ...

Page 2

... This specification is applicable to chip type multilayer ceramic capacitors with a priority over the other relevant specifications. Production places defined in this specification shall be TDK Corporation Japan, TDK Taiwan Corporation, TDK Xiamen Co.,Ltd, TDK(Suzhou)Co.,Ltd, TDK Korea Corporation, TDK(Malaysia)Sdn.Bhd, TDK Components U.S.A. Inc, and TDK Hungary Ltd. ...

Page 3

Temperature Characteristics (Details are shown in table 1 No.6 and No.7 at page 6) (3) Rated Voltage (4) Rated Capacitance Stated in three digits and in units of pico farads (pF). The first and Second digits identify the first ...

Page 4

RATED CAPACITANCE AND TOLERANCE 3.1 Standard combination of rated capacitance and tolerances Temperature Class Characteristics 10pF and 1 C0G 12pF to 10,000pF 10,000pF 10uF and X5R X7R Over 10uF 2 0.1uF and Y5V Over 0.1uF *1 The standard capacitance ...

Page 5

STORING CONDITION AND TERM 5 to 40° 70%RH 6 months Max. 6. P.C. BOARD When mounting on an aluminum substrate, large case sizes such as C3225, C4532 and C5750 types are more likely to be affected ...

Page 6

... Item 1 External Appearance No defects which may affect performance. 2 Insulation Resistance 10,000MΩ or 500MΩ·μF min. (As for the capacitors of rated voltage 16, 10, 6.3V DC and the item below, 10,000 MΩ or 100MΩ·μF min.,) whichever smaller. C1005X5R1E683 C1005X5R1E104 C1608X5R1E334 C1608X5R1E474 ...

Page 7

... Capacitance drift within ± 0.2% or ± 0.05pF, whichever larger. 7 Temperature Characteristics of Capacitance (Class2) 8 Robustness of No sign of termination coming off, Terminations breakage of ceramic, or other abnormal signs. 9 Bending No mechanical damage. Performance Temperature coefficient shall be calculated based on values at 25°C and T.C. Temperature Coefficient 85°C temperature. ...

Page 8

... Performance New solder to cover over 75% of termination. 25% may have pin holes or rough spots but not concentrated in one spot. Ceramic surface of A sections shall not be exposed due to melting or shifting of termination material. A section No cracks are allowed and terminations shall be covered at least 60% with new solder. ...

Page 9

... Repeat this for 2h each in 3 perpendicular directions. Reflow solder the capacitors on a P.C.Board shown in Appendix 1a or Appendix 1b before testing. Expose the capacitors in the condition step1 through step 4 and repeat 5 times consecutively. Leave the capacitors in ambient condition for 6 to 24h (Class 1) or 24± ...

Page 10

... X5R : 200% of initial spec. max. X7R : 200% of initial spec. max. Y5V : 150% of initial spec. max. 1,000MΩ or 50MΩ·μF min. (As for the capacitors of rated voltage 16, 10, 6.3V DC and item below, 1,000MΩ or 10MΩ·μF min.,) whichever smaller. ...

Page 11

... X5R : 200% of initial spec. max. X7R : 200% of initial spec. max. Y5V : 150% of initial spec. max. 500MΩ or 25MΩ·μF min. (As for the capacitors of rated voltage 16, 10, 6.3V DC and item below, 500MΩ or 5MΩ·μF min.,) whichever smaller. ...

Page 12

... D.F. (Class2) Insulation Resistance *As for the initial measurement of capacitors (Class2) on number 7,11,12,13 and 14, leave capacitors at 150 –10,0°C for 1 hour and measure the value after leaving capacitors for 24±2h in ambient condition. Performance No mechanical damage. Change from the Characteristics value before test ...

Page 13

Appendix - 1a P.C. Board for reliability test Applied for C0603, C1005, C1608, C2012, C3216 100 c Solder resist Appendix - 2a P.C. Board for bending test Applied for C0603, C1005 100 b Solder resist (Unit : mm) Material : ...

Page 14

INSIDE STRUCTURE AND MATERIAL No. NAME 1 Dielectric 2 Electrode 3 4 Termination 5 10. RECOMMENDATION As for C3225, C4532 and C5750 types recommended to provide a slit (about 1mm wide) in the board under the components ...

Page 15

... Caution No. Process 1-1. Storage 1 Operating 1) The capacitors must be stored in an ambient temperature 40°C with a Condition relative humidity 70%RH. The products should be used within 6 months upon receipt. (Storage, Transportation) 2) The capacitors must be operated and stored in an environment free of dew condensation and these gases such as Hydrogen Sulphide, Hydrogen Sulphate, Chlorine, Ammonia and sulfur ...

Page 16

... Designing capacitors. P.C.board 1) The greater the amount of solder, the higher the stress on the chip capacitors, and the more likely that it will break. When designing a P.C.board, determine the shape and size of the solder lands to have proper amount of solder on the terminations. 2) Avoid using common solder land for multiple terminations and provide individual solder land for each terminations ...

Page 17

... No. Process 3 Designing 4) Recommended chip capacitors layout is as following. P.C.board Mounting face Chip arrangement (Direction) Distance from slit Condition Disadvantage against bending stress Perforation or slit Break P.C.board with mounted side up. Mount perpendicularly to Mount in parallel with perforation or slit perforation or slit Perforation or slit Closer to slit is higher stress Away from slit is less stress ℓ ...

Page 18

... No. Process 3 Designing 5) Mechanical stress varies according to location of chip capacitors on the P.C.board. P.C.board Perforation 6) Layout recommendation Example Need to avoid Recommen- dation Condition E A Slit The stress in capacitors is in the following order. A > > D > E Use of common Soldering with solder land chassis Lead wire ...

Page 19

... See following examples. Single sided mounting Double-sides mounting When the centering jaw is worn out, it may give mechanical impact on the capacitors to cause crack. Please control the close up dimension of the centering jaw and provide sufficient preventive maintenance and replacement of it. 4-2. Amount of adhesive Condition ...

Page 20

... Flux selection Soldering Although highly-activated flux gives better solderability, substances which increase activity may also degrade the insulation of the chip capacitors. To avoid such degradation recommended following recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine). Strong flux is not recommended. ...

Page 21

... Please make sure the tip temp. before soldering and keep the peak temp and time in accordance with following recommended condition. (Please preheat the chip capacitors with the condition in 5-4 to avoid the thermal shock.) Recommended solder iron condition (Pb-Sn Solder and Lead Free Solder) ...

Page 22

... No. Process 2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors 5 Soldering may cause crack. Do not touch the ceramic dielectric and the terminations by solder iron. 5-7. Sn-Zn solder Sn-Zn solder affects product reliability. Please contact TDK in advance when utilize Sn-Zn solder. ...

Page 23

... When functional check of the P.C.board is performed, check pin pressure tends to be adjusted higher for fear of loose contact. But if the pressure is excessive and bend the P.C.board, it may crack the chip capacitors or peel the terminations off. Please adjust the check pins not to bend the P.C.board. ...

Page 24

... Piling the P.C.board after mounting for storage or handling, the corner of the P.C. board may hit the chip capacitors of another board to cause crack. The capacitors (Class 2) have aging in the capacitance. They may not be used in 10 Capacitance aging precision time constant circuit. In case of the time constant circuit, the evaluation should be done well ...

Page 25

Packaging label Packaging shall be done to protect the components from the damage during transportation and storing, and a label which has the following information shall be attached. 1) Inspection No. 2) TDK P/N 3) Customer's P/N 4) Quantity ...

Page 26

TAPE PACKAGING SPECIFICATION 1. CONSTRUCTION AND DIMENSION OF TAPING 1-1. Dimensions of carrier tape Dimensions of paper tape shall be according to Appendix Dimensions of plastic tape shall be according to Appendix 6, 7. 1-2. Bulk ...

Page 27

CHIP QUANTITY Please refer to the table A in the end of the specification. 3. PERFORMANCE SPECIFICATIONS 3-1. Fixing peeling strength (top tape) 0.05-0.7N. (See the following figure.) Carrier tape Bottom cover tape (Paper carrier tape of type 2) ...

Page 28

Pitch hole A B Symbol A Type C0603 ( 0. 0.68 ) (CC0201) C1005 ( 0. 1.15 ) (CC0402) Symbol G Type C0603 (CC0201) 2.00 ± 0.05 4.00 ± 0.05 C1005 (CC0402) * The ...

Page 29

Pitch hole Symbol A Type C1608 ( 1. 1.90 ) (CC0603) C2012 ( 1. 2.30 ) (CC0805) C3216 ( 1. 3.50 ) (CC1206) Symbol G Type C1608 (CC0603) C2012 2.00 ± ...

Page 30

Pitch hole Symbol A Type C2012 ( 1. 2.30 ) (CC0805) C3216 ( 1. 3.50 ) (CC1206) C3225 ( 2. 3.60 ) (CC1210) Symbol G Type C2012 (CC0805) C3216 2.00 ...

Page 31

Pitch hole Symbol A Type C4532 ( 3. 4.90 ) (CC1812) C5750 ( 5. 6.10 ) (CC2220) Symbol G Type C4532 (CC1812) 2.00 ± 0.05 4.00 ± 0.10 C5750 (CC2220) * The ...

Page 32

C0603, C1005, C1608, C2012, C3216, C3225 ( As for C3225 type, any thickness of the item except 2.5mm ) Symbol A Dimension Ø178 ± 2.0 Ø60 ± 2.0 Symbol W 2 Dimension 13.0 ± 1.4 C3225, C4532, C5750 ( As ...

Page 33

Appendix 10 C1005, C1608, C2012, C3216, C3225 ( As for C3225 type, any thickness of the item except 2.5mm ) Symbol A B Ø382 max. (Nominal Dimension Ø50 min. Ø330) Symbol t r Dimension 2.0 ± 0.5 1.0 C3225, C4532, ...

Page 34

Table A (TDK products line up) No Your Part No. TDK product L (mm) 1 C0603C0G1E0R5C 0.60±0.03 2 C0603C0G1E010C 0.60±0.03 3 C0603C0G1E1R5C 0.60±0.03 4 C0603C0G1E020C 0.60±0.03 5 C0603C0G1E2R2C 0.60±0.03 6 C0603C0G1E030C 0.60±0.03 7 C0603C0G1E3R3C 0.60±0.03 8 C0603C0G1E040C 0.60±0.03 9 ...

Page 35

No Your Part No. TDK product L (mm) 48 C0603Y5V1C103Z 0.60±0.03 49 C1005C0G1H0R5C 1.00±0.05 50 C1005C0G1H010C 1.00±0.05 51 C1005C0G1H1R5C 1.00±0.05 52 C1005C0G1H020C 1.00±0.05 53 C1005C0G1H2R2C 1.00±0.05 54 C1005C0G1H030C 1.00±0.05 55 C1005C0G1H3R3C 1.00±0.05 56 C1005C0G1H040C 1.00±0.05 57 C1005C0G1H4R7C 1.00±0.05 58 C1005C0G1H050C ...

Page 36

No Your Part No. TDK product L (mm) 85 C1005X5R1E333K 1.00±0.05 86 C1005X5R1E473K 1.00±0.05 87 C1005X5R1E683K 1.00±0.05 88 C1005X5R1E104K 1.00±0.05 89 C1005X5R1C683K 1.00±0.05 90 C1005X5R1C104K 1.00±0.05 91 C1005X5R1C154K 1.00±0.05 92 C1005X5R1C224K 1.00±0.05 93 C1005X5R1C334K 1.00±0.05 94 C1005X5R1C474K 1.00±0.05 95 C1005X5R1C684K ...

Page 37

No Your Part No. TDK product L (mm) 128 C1005Y5V1E104Z 1.00±0.05 129 C1005Y5V1E224Z 1.00±0.05 130 C1005Y5V1A474Z 1.00±0.05 131 C1005Y5V0J105Z 1.00±0.05 132 C1608C0G1H0R5C 1.60±0.10 133 C1608C0G1H010C 1.60±0.10 134 C1608C0G1H1R5C 1.60±0.10 135 C1608C0G1H020C 1.60±0.10 136 C1608C0G1H2R2C 1.60±0.10 137 C1608C0G1H030C 1.60±0.10 138 C1608C0G1H3R3C ...

Page 38

No Your Part No. TDK product L (mm) 178 C1608X5R1E224K 1.60±0.10 179 C1608X5R1E334K 1.60±0.10 180 C1608X5R1E474K 1.60±0.10 181 C1608X5R1E684K 1.60±0.10 182 C1608X5R1E105K 1.60±0.10 183 C1608X5R1C474K 1.60±0.10 184 C1608X5R1C684K 1.60±0.10 185 C1608X5R1C105K 1.60±0.10 186 C1608X5R1C155K 1.60±0.10 187 C1608X5R1C225K 1.60±0.10 188 C1608X5R1A684K ...

Page 39

No Your Part No. TDK product L (mm) 221 C1608Y5V1H104Z 1.60±0.10 222 C1608Y5V1H224Z 1.60±0.10 223 C1608Y5V1H474Z 1.60±0.10 224 C1608Y5V1E105Z 1.60±0.10 225 C1608Y5V1C225Z 1.60±0.10 226 C1608Y5V0J475Z 1.60±0.10 227 C2012C0G1H392J 2.00±0.20 228 C2012C0G1H472J 2.00±0.20 229 C2012C0G1H562J 2.00±0.20 230 C2012C0G1H682J 2.00±0.20 231 C2012C0G1H822J ...

Page 40

No Your Part No. TDK product L (mm) 267 C2012Y5V1H105Z 2.00±0.20 268 C2012Y5V1H225Z 2.00±0.20 269 C2012Y5V1E475Z 2.00±0.20 270 C2012Y5V1C106Z 2.00±0.20 271 C2012Y5V0J226Z 2.00±0.20 272 C3216C0G1H153K 3.20±0.20 273 C3216C0G1H223K 3.20±0.20 274 C3216C0G1H333K 3.20±0.20 275 C3216X5R1H105K 3.20±0.20 276 C3216X5R1E155K 3.20±0.20 277 C3216X5R1E225K ...

Page 41

No Your Part No. TDK product L (mm) 302 C3216Y5V1H475Z 3.20±0.20 303 C3216Y5V1E106Z 3.20±0.20 304 C3216Y5V1C226Z 3.20±0.20 305 C3216Y5V0J476Z 3.20+0.30/-0.10 306 C3225C0G1H473K 3.20±0.40 307 C3225C0G1H683K 3.20±0.40 308 C3225C0G1H104K 3.20±0.40 309 C3225X5R1H225K 3.20±0.40 310 C3225X5R1H335K 3.20±0.40 311 C3225X5R1E475K 3.20±0.40 312 C3225X5R1E685K ...

Page 42

No Your Part No. TDK product L (mm) 340 C4532C0G1H154K 4.50±0.40 341 C4532C0G1H224K 4.50±0.40 342 C4532X5R1H475K 4.50±0.40 343 C4532X5R1H685K 4.50±0.40 344 C4532X5R1E106K 4.50±0.40 345 C4532X5R1E156M 4.50±0.40 346 C4532X5R1E226M 4.50±0.40 347 C4532X5R1C336M 4.50±0.40 348 C4532X5R1A476M 4.50±0.40 349 C4532X5R0J107M 4.50±0.40 350 C4532X7R1H225K ...

Page 43

No Your Part No. TDK product L (mm) 390 C1608C0G2E101J 1.60±0.10 391 C1608C0G2E121J 1.60±0.10 392 C1608C0G2E151J 1.60±0.10 393 C1608C0G2E181J 1.60±0.10 394 C1608C0G2E221J 1.60±0.10 395 C1608C0G2E271J 1.60±0.10 396 C1608C0G2E331J 1.60±0.10 397 C1608C0G2E391J 1.60±0.10 398 C1608C0G2E471J 1.60±0.10 399 C1608C0G2E561J 1.60±0.10 400 C1608C0G2E681J ...

Page 44

No Your Part No. TDK product L (mm) 425 C3216C0G2J101J 3.20±0.20 426 C3216C0G2J121J 3.20±0.20 427 C3216C0G2J151J 3.20±0.20 428 C3216C0G2J181J 3.20±0.20 429 C3216C0G2J221J 3.20±0.20 430 C3216C0G2J271J 3.20±0.20 431 C3216C0G2J331J 3.20±0.20 432 C3216C0G2J391J 3.20±0.20 433 C3216C0G2J471J 3.20±0.20 434 C3216C0G2J561J 3.20±0.20 435 C3216C0G2J681J ...

Page 45

No Your Part No. TDK product L (mm) 463 C1608X7R2A102K 1.60±0.10 464 C1608X7R2A152K 1.60±0.10 465 C1608X7R2A222K 1.60±0.10 466 C1608X7R2A332K 1.60±0.10 467 C1608X7R2A472K 1.60±0.10 468 C1608X7R2A682K 1.60±0.10 469 C1608X7R2A103K 1.60±0.10 470 C1608X7R2A153K 1.60±0.10 471 C1608X7R2A223K 1.60±0.10 472 C2012X7R2A333K 2.00±0.20 473 C2012X7R2A473K ...

Page 46

No Your Part No. TDK product L (mm) 504 C3225X7R2A684K 3.20±0.40 505 C3225X7R2A105K 3.20±0.40 506 C3225X7R2A225K 3.20±0.40 507 C3225X7R2E154K 3.20±0.40 508 C3225X7R2E224K 3.20±0.40 509 C3225X7R2J473K 3.20±0.40 510 C3225X7R2J683K 3.20±0.40 511 C4532X7R2A155K 4.50±0.40 512 C4532X7R2A225K 4.50±0.40 513 C4532X7R2E334K 4.50±0.40 514 C4532X7R2E474K ...

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