C2012X7R1E225M TDK Corporation, C2012X7R1E225M Datasheet - Page 70

• Manufacturer Part Number: C2012X7R1E225M
• Description: CAP CER 2.2UF 25V 20% X7R 0805
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C2012X7R1E225M

• Capacitance: 2.2µF
• Voltage - Rated: 25V
• Tolerance: ±20%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Applications: General Purpose
• Ratings: -
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (max): -
• Thickness (max): 0.057" (1.45mm)
• Lead Spacing: -
• Features: -
• Lead Style: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 445-7570-2

Wave Soldering
Symbol
Reflow Soldering
Symbol
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
TDK MLCC US Catalog
A
B
C
A
B
C
A
B
C
Type
Type
Type
Soldering
Information
C
B
0.25 - 0.35
0.25 - 0.35
[CC0603]
[CC0201]
[CC1206]
0.7 - 1.0
0.8 - 1.0
0.6 - 0.8
0.2 - 0.3
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
C1608
C0603
C3216
Chip capacitor
A
0.35 - 0.45
[CC0805]
[CC0402]
[CC1210]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
0.3 - 0.5
0.4 - 0.6
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
C2012
C1005
C3225
Solder land
[CC1206]
[CC0603]
[CC1812]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Unit: mm
C3216
C1608
C4532
Maximum amount
Minimum amount
Solder resist
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
[CC0805]
[CC2220]
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
C2012
C5750
Unit: mm
Unit: mm
Page 72
Peak
Temp
C Series – General Application
• Recommended Soldering Profile
0
Solder
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free
Soldering
Over 60 sec.
soldering
soldering
soldering
Preheating
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Manual
Reflow
Solder
Solder
Sn-Pb
Wave
Wave Soldering
△T
Temp./
Dura.
Peak Temp time
Soldering
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
300
Peak temp
0
250 max.
260 max.
(°C)
Over 60 sec.
Wave Soldering
Natural
cooling
Case Size - JIS (EIA)
∆T
Manual soldering
Preheating
(Solder iron)
Duration
3 max.
5 max.
3sec. (As short as possible)
(sec.)
Peak
Temp
0
Over 60 sec.
∆T
Preheating
Peak temp
230 max.
260 max.
Reflow Soldering
(°C)
Reflow Soldering
Peak Temp time
Soldering Natural
Version B11
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
Duration
20 max.
10 max.
(sec.)
cooling