C8051F502-IMR Silicon Laboratories Inc, C8051F502-IMR Datasheet - Page 39

• Manufacturer Part Number: C8051F502-IMR
• Description: MCU 8-Bit C8051F50x 8051 CISC 64KB Flash 2.5V/3.3V/5V 32-Pin QFN EP T/R
• Manufacturer: Silicon Laboratories Inc

Specifications of C8051F502-IMR

• Package: 32QFN EP
• Device Core: 8051
• Family Name: C8051F50x
• Maximum Speed: 50 MHz
• Ram Size: 4.25 KB
• Program Memory Size: 64 KB
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 8 Bit
• Program Memory Type: Flash
• Number Of Programmable I/os: 25
• Interface Type: I2C/SPI/UART
• On-chip Adc: 32-chx12-bit
• Operating Temperature: -40 to 125 °C
• Number Of Timers: 4

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
5. The stencil thickness should be 0.125mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A 3x3 array of 1.0 mm openings on a 1.20 mm pitch should be used for the center ground pad.
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Dimension
metal pad is to be 60  m minimum, all the way around the pad.
good solder paste release.
Components.
C1
C2
X1
e
Table 4.10. QFN-32 Landing Diagram Dimensions
4.80
4.80
0.20
Min
Figure 4.10. QFN-32 Package Drawing
0.50 BSC
Max
4.90
4.90
0.30
Rev. 1.2
Dimension
X2
Y1
Y2
C8051F50x/F51x
3.20
0.75
3.20
Min
Max
3.40
0.85
3.40
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