NCP4894DMR2G ON Semiconductor, NCP4894DMR2G Datasheet - Page 5

• Manufacturer Part Number: NCP4894DMR2G
• Description: IC AMP AUDIO PWR 1W DIFF MICRO10
• Manufacturer: ON Semiconductor
• Type: Class ABr

Specifications of NCP4894DMR2G

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 1.8W x 1 @ 8 Ohm
• Voltage - Supply: 2.2 V ~ 5.5 V
• Features: Depop, Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 1-Channel Mono
• Output Power (typ): 1.08x1@8OhmW
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.006@8Ohm@1000mW%
• Single Supply Voltage (typ): 3/5V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 85dB
• Single Supply Voltage (min): 2.2V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 10
• Package Type: Micro
• Amplifier Class: AB
• No. Of Channels: 2
• Output Power: 1.8W
• Supply Voltage Range: 2.2V To 5.5V
• Load Impedance: 8ohm
• Operating Temperature Range: -40°C To +85°C
• Amplifier Case Style: SMD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NCP4894DMR2G; NCP4894DMR2GOSTR

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T
3. The thermal shutdown set to 160°C (typical) avoids irreversible damage on the device due to power dissipation. For further information see
4. For the 9−Pin Flip−Chip CSP package, the R
5. Human Body Model, 100 pF discharge through a 1.5 kW resistor following specification JESD22/A114.
6. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
7. Maximum ratings per JEDEC standard JESD78.
MAXIMUM RATINGS
Supply Voltage
Operating Supply Voltage
Input Voltage
Max Output Current
Power Dissipation (Note 3)
Operating Ambient Temperature
Max Junction Temperature
Storage Temperature Range
Thermal Resistance Junction−to−Air
ESD Protection
Latchup Current at T
page 7.
50 mm
all need to be connected to optimize the power dissipation.
2
total area and also 135°C/W with 500 mm
A
= 85°C (Note 7)
(Note 2)
Rating
Human Body Model (HBM) (Note 5)
Machine Model (MM) (Note 6)
qJA
is highly dependent of the PCB Heatsink area. For example, R
2
. For further information see page 10. The bumps have the same thermal resistance and
9−Pin Flip−Chip
http://onsemi.com
DFN 3x3 mm
NCP4894
Micro−10
5
Symbol
Op VP
R
Iout
T
VP
V
Pd
T
T
stg
qJA
−
−
A
in
J
Internally Limited
−0.3 to Vcc +0.3
−65 to +150
2.2 to 5.5 V
−40 to +85
100 mA
(Note 4)
> 2000
Value
> 200
500
150
200
A
6.0
70
= +25°C.
qJA
can equal 195°C/W with
°C/W
Unit
mA
°C
°C
°C
V
V
V
−
−