TD62002P TOSHIBA Semiconductor CORPORATION, TD62002P Datasheet
TD62002P
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TD62002P Summary of contents
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... Inputs compatible with various types of logic l Package Type− DIP−16 pin l Package Type− SOP−16 pin INPUT BASE TYPE RESISTOR TD62001P / External 10.5−kΩ TD62002P / Zenner diode TD62003P / 2.7 kΩ TD62004P / 10.5 kΩ PIN CONNECTION (TOP VIEW) TD62001~004P/AP/F/AF ...
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... Clamp Diode Reverse Voltage AP, AF Clamp Diode Forward Current P AP Power Dissipation Operating Temperature AP Storage Temperature Note 1: Except TD62001P / Note 2: Only TD62001P / Note 3: On glass epoxy PCB (30 × 30 × 1 50%) TD62002P / SYMBOL RATING UNIT −0.5~ (SUS) −0.5~50 I 500 OUT V (Note 1) −0.5~30 IN ...
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RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C and Ta = −30~75°C for only Type−P) CHARACTERISTIC P, F Output Sustaining Voltage AP Output Current Except Input Voltage TD62001P / TD62002 Input Voltage ...
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ELECTRICAL CHARACTERISTICS CHARACTERISTIC AP, AF Output Leakage F Current P Collector−Emitter Saturation Voltage DC Current Transfer Ratio TD62002 Input Current TD62003 (Output On) TD62004 P Input Current (Output Off) AP TD62002 Input Voltage TD62003 (Output On) TD62004 AP, ...
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TEST CIRCUIT 1. I CEX (OFF (sat (ON) 5 TD62001~004P/AP/F/AF 3. IIN (ON 2001-06-27 ...
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... OFF Note 1: Pulse width 50 µs, duty cycle 10% Output impedance 50 Ω, t Note 2: See below INPUT CONDITION TYPE NUMBER TD62001P / TD62002P / TD62003P / TD62004P / Note 3: C includes probe and jig capacitance. L PRECAUTIONS for USING This IC does not include built-in protection circuits for excess current or overvoltage. ...
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TD62001~004P/AP/F/AF 7 2001-06-27 ...
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TD62001~004P/AP/F/AF 8 2001-06-27 ...
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TD62001~004P/AP/F/AF 9 2001-06-27 ...
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TD62001~004P/AP/F/AF 10 2001-06-27 ...
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PACKAGE DIMENSIONS DIP16−P−300−2.54A Weight: 1.11 g (Typ.) TD62001~004P/AP/F/AF 11 Unit : mm 2001-06-27 ...
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PACKAGE DIMENSIONS SOP16−P−225−1.27 Weight: 0.16 g (Typ.) TD62001~004P/AP/F/AF 12 Unit : mm 2001-06-27 ...
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RESTRICTIONS ON PRODUCT USE · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress ...