XPC8260ACZUMIBA Motorola, XPC8260ACZUMIBA Datasheet
XPC8260ACZUMIBA
Related parts for XPC8260ACZUMIBA
XPC8260ACZUMIBA Summary of contents
Page 1
Technical Data MPC8260AEC/D Rev. 0.9 8/2003 MPC826xA (HiP4) Family Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for .25 µ m (HiP4) devices in the PowerQUICC II™ MPC8260 communications processor family. ...
Page 2
... Ports Ports Figure 1. MPC8266 Block Diagram System Interface Unit (SIU) 60x Bus Bus Interface Unit PCI Bus 32 bits MHz 60x-to-PCI 2,3 Bridge 60x-to-Local Local Bus Bridge 32 bits MHz Memory Controller Clock Counter System Functions 2 SMC2 SPI I C Non-Multiplexed I/O MOTOROLA 2,3 or ...
Page 3
... Three user programmable machines, general-purpose chip-select machine, and page-mode pipeline SDRAM machine — Byte selects for 64 bus width (60x) and byte selects for 32 bus width (local) MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Features 3 ...
Page 4
... One serial peripheral interface identical to the MPC860 SPI — One inter-integrated circuit (I – Microwire compatible – Multiple-master, single-master, and slave modes — eight TDM interfaces (four on the MPC8255) 4 MPC826xA (HiP4) Family Hardware Specifications 2 C) controller (identical to the MPC860 controller) MOTOROLA ...
Page 5
... Independent transmit and receive routing, frame synchronization – Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN primary rate, Motorola interchip digital link (IDL), general circuit interface (GCI), and user-defined TDM serial interfaces — Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs, SCCs, SMCs, and serial channels — ...
Page 6
... Makes use of the local bus signals, so there is no need for additional pins 1.2 Electrical and Thermal Characteristics This section provides AC and DC electrical specifications and thermal characteristics for the MPC826xA. 6 MPC826xA (HiP4) Family Hardware Specifications l capabilities MOTOROLA ...
Page 7
... Vdc). This device contains circuitry protecting against damage due to high static voltage or electrical fields; however advised that normal precautions be taken to avoid application of any voltages higher than MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Electrical and Thermal Characteristics Table 1 ...
Page 8
... MPC826xA (HiP4) Family Hardware Specifications Not to exceed 10 SDRAM_CLK Table 3. DC Electrical Characteristics Symbol IHC V ILC VDDH Min Max Unit 2.0 3.465 V GND 0.8 V 2.4 3.465 V GND 0.4 V — 10 µA — 10 µA — 1 µA — 1 µA 2.4 — V — 0.5 V MOTOROLA ...
Page 9
... DP(5)/TBEN/IRQ5/EXT_DBG3 DP(6)/CSE(0)/IRQ6 DP(7)/CSE(1)/IRQ7 PSDVAL TA TEA GBL/IRQ1 CI/BADDR29/IRQ2 WT/BADDR30/IRQ3 L2_HIT/IRQ4 CPU_BG/BADDR31/IRQ5 CPU_DBG CPU_BR IRQ0/NMI_OUT IRQ7/INT_OUT/APE PORESET HRESET SRESET RSTCONF QREQ MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Electrical and Thermal Characteristics 1 (Continued) Symbol Min Max V — 0.4 OL Unit V 9 ...
Page 10
... The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC current recommended to either pull unused pins to GND or VDDH configure them as outputs. 2 The leakage current is measured for nominal VDD, VCCSYN, and VDD. 3 MPC8265 and MPC8266 only. 10 MPC826xA (HiP4) Family Hardware Specifications 1 (Continued) Symbol Min Max Unit — 0.4 V MOTOROLA ...
Page 11
... Solving equations (1) and (2) for K gives 273° where constant pertaining to the particular part. K can be determined from equation (3) by measuring P (at equilibrium) for a known T D equations (1) and (2) iteratively for any value of T MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Symbol Value θ ...
Page 12
... C) and GND planes (W) INT Vddl 2.0 Volts Maximum Nominal Maximum 2 1.8 2.3 2.1 1.9 2.3 — 2.3 2.9 — 2.4 3.1 — 2.2 2.8 — 2.2 2.8 — 2.4 3.1 MOTOROLA ...
Page 13
... Timings are measured at the pin. Note that although the specifications generally reference the rising edge of the clock, the following AC timing diagrams also apply when the falling edge is the active edge. MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Electrical and Thermal Characteristics Table 6. Output Buffer Impedances Typical Impedance (Ω ...
Page 14
... Figure 4 shows the FCC internal clock. BRG_OUT sp16a FCC input signals FCC output signals Note: When GFMR[TCI FCC output signals Note: When GFMR[TCI MPC826xA (HiP4) Family Hardware Specifications sp17b sp36b/sp37b Figure 3. FCC External Clock Diagram sp17a sp36a/sp37a Figure 4. FCC Internal Clock Diagram sp36b/sp37b sp36a/sp37a MOTOROLA ...
Page 15
... Input sampled on the rising edge and output driven on the falling edge. 3. Input sampled on the falling edge and output driven on the falling edge. 4. Input sampled on the falling edge and output driven on the rising edge. Figure 6. SCC/SMC/SPI/I MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Electrical and Thermal Characteristics 2 C external clock ...
Page 16
... Note: TGATE is asserted on the rising edge of the clock deasserted on the falling edge. Figure 8. PIO, Timer, and DMA Signal Diagram 16 MPC826xA (HiP4) Family Hardware Specifications sp20 sp21 sp40/sp41 Figure 7. TDM Signal Diagram Sys clk sp22 (See note) (See note) sp23 sp23 sp22 sp42/sp43 sp42/sp43 sp42a/sp43a MOTOROLA ...
Page 17
... AC timing. When data pipelining is activated, sp12 can be used for data bus setup even when ECC or PARITY are used. Also, sp33a can be used as the AC specification for DP signals. Figure 9 shows the interaction of several bus signals. MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Electrical and Thermal Characteristics Characteristic ...
Page 18
... DATA bus, ECC, and PARITY mode input signals 18 MPC826xA (HiP4) Family Hardware Specifications sp11 sp12 sp15 sp31 sp32 sp33a sp35 Figure 9. Bus Signals CLKin sp13 sp14 DP mode input signal DP mode output signal Figure 10. Parity Mode Diagram sp10 sp10 sp10 sp30 sp30 sp30 sp30 sp10 sp10 sp33b/sp30 MOTOROLA ...
Page 19
... Figure graphical representation of Table 11. CLKin T1 CLKin T1 CLKin T1 Figure 12. Internal Tick Spacing for Memory Controller Signals MOTOROLA MPC826xA (HiP4) Family Hardware Specifications sp34/sp30 Figure 11. MEMC Mode Diagram NOTE Tick Spacing (T1 Occurs at the Rising Edge of CLKin 1/4 CLKin 1/2 CLKin ...
Page 20
... MHz 3 100 MHz 4 133 MHz 4 133 MHz 2 133 MHz 2 133 MHz 2.5 166 MHz 2.5 166 MHz Core Multiplication Core Factor Frequency 4 133 MHz 5 166 MHz 4 133 MHz 5 166 MHz 2.5 166 MHz 3 200 MHz 2.5 166 MHz 3 200 MHz MOTOROLA ...
Page 21
... MHz 0011_010 33 MHz 0011_011 33 MHz 0011_100 33 MHz 0011_101 33 MHz 0011_110 33 MHz 0011_111 33 MHz 0100_000 33 MHz MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Table 13. Clock Configuration Modes CPM Multiplication CPM 2,3 2 Factor Frequency 2 66 MHz 2 66 MHz 2 66 MHz 2 66 MHz ...
Page 22
... MHz 3.5 233 MHz 4 266 MHz 4.5 300 MHz 2 133 MHz 2.5 166 MHz 3 200 MHz 3.5 233 MHz 4 266 MHz 4.5 300 MHz 2 133 MHz 2.5 166 MHz 3 200 MHz 3.5 233 MHz 4 266 MHz 4.5 300 MHz MOTOROLA 2 ...
Page 23
... The minimum Tval = 2 when PCI_MODCK = 1, and the minimum Tval = 1 when PCI_MODCK = 0. Therefore, designers should use clock configurations that fit this condition to achieve PCI-compliant AC timing. Clock configurations change only after POR is asserted. MOTOROLA MPC826xA (HiP4) Family Hardware Specifications 1 (Continued) ...
Page 24
... MHz 3/6 33/16 MHz 166 MHz 4/8 33/16 MHz 200 MHz 4/8 33/16 MHz 233 MHz 4/8 33/16 MHz 266 MHz 4/8 33/16 MHz 166 MHz 5 33 MHz 200 MHz 5 33 MHz 233 MHz 5 33 MHz 266 MHz 5 33 MHz MOTOROLA 2 2 ...
Page 25
... MHz 1000_001 66 MHz 1000_010 66 MHz 1000_011 66 MHz 1000_100 66 MHz 1001_000 66 MHz 1001_001 66 MHz 1001_010 66 MHz 1001_011 66 MHz MOTOROLA MPC826xA (HiP4) Family Hardware Specifications CPM Core CPM Multiplication Frequency Factor 6 200 MHz 5 6 200 MHz 6 6 200 MHz 7 6 200 MHz ...
Page 26
... MHz 300 MHz 3/6 66/33 MHz 350 MHz 3/6 66/33 MHz 400 MHz 3/6 66/33 MHz 200 MHz 4/8 62/31 MHz 250 MHz 4/8 62/31MHz 300 MHz 4/8 62/31 MHz 350 MHz 4/8 62/31 MHz 400 MHz 4/8 62/31 MHz MOTOROLA 2 ...
Page 27
... MHz 0010_001 50/25 MHz 0010_010 50/25 MHz 0010_011 50/25 MHz 0010_100 50/25 MHz 0011_000 66/33 MHz 0011_001 66/33 MHz MOTOROLA MPC826xA (HiP4) Family Hardware Specifications CPM Core CPM Multiplication Frequency 2 Factor 2/4 133 MHz 2.5 2/4 133 MHz ...
Page 28
... MHz 2 100 MHz 250 MHz 2 100 MHz 300 MHz 2 100 MHz 350 MHz 2 100 MHz 160 MHz 2.5 80 MHz 200 MHz 2.5 80 MHz 240 MHz 2.5 80 MHz 280 MHz 2.5 80 MHz 320 MHz 2.5 80 MHz 360 MHz 2.5 80 MHz MOTOROLA 4 ...
Page 29
... Pinout This section provides the pin assignments and pinout list for the MPC826xA. 1.4.1 Pin Assignments Figure 13 shows the pinout of the MPC826xA’s 480 TBGA package as viewed from the top surface. MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Core CPM Multiplication ...
Page 30
... Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view. Copper Heat Spreader (Oxidized for Insulation) Polymide Tape Soldermask 1.27 mm Pitch Figure 14. Side View of the TBGA Package 30 MPC826xA (HiP4) Family Hardware Specifications View Die Attach Die Glob-Top Filled Area Glob-Top Dam Copper Traces Pressure Sensitive Adhesive Etched Cavity MOTOROLA ...
Page 31
... Table 19 shows the pinout list of the MPC826xA. Table 20 defines conventions and acronyms used in Table 19. Pin Name BR BG ABB/IRQ2 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Table 19. Pinout List ...
Page 32
... TBST TSIZ0 TSIZ1 TSIZ2 TSIZ3 AACK ARTRY DBG DBB/IRQ3 D10 D11 D12 D13 D14 D15 D16 D17 32 MPC826xA (HiP4) Family Hardware Specifications Table 19. Pinout List (Continued) Ball B20 A18 A16 A13 E12 A20 E17 B15 B13 A11 D19 D17 MOTOROLA ...
Page 33
... D34 D35 D36 D37 D38 D39 D40 D41 D42 D43 D44 D45 D46 D47 D48 D49 D50 D51 D52 MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Table 19. Pinout List (Continued) Pinout Ball D15 C13 B11 C19 C17 C15 D13 C11 E18 ...
Page 34
... CPU_BG/BADDR31/IRQ5 CPU_DBG CPU_BR CS0 CS1 CS2 CS3 CS4 CS5 34 MPC826xA (HiP4) Family Hardware Specifications Table 19. Pinout List (Continued) Ball B18 B16 E14 D12 C10 B22 A22 E21 D21 C21 B21 A21 E20 V3 C22 F25 C29 E27 E28 F26 F27 MOTOROLA ...
Page 35
... PSDCAS/PGPL3 PGTA/PUPMWAIT/PGPL4/PPBS PSDAMUX/PGPL5 1 LWE0/LSDDQM0/LBS0/PCI_CFG0 1 LWE1/LSDDQM1/LBS1/PCI_CFG1 1 LWE2/LSDDQM2/LBS2/PCI_CFG2 1 LWE3/LSDDQM3/LBS3/PCI_CFG3 1 LSDA10/LGPL0/PCI_MODCKH0 1 LSDWE/LGPL1/PCI_MODCKH1 LOE/LSDRAS/LGPL2/PCI_MODCKH2 1 LSDCAS/LGPL3/PCI_MODCKH3 LGTA/LUPMWAIT/LGPL4/LPBS 1 LGPL5/LSDAMUX/PCI_MODCK LWR MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Table 19. Pinout List (Continued) 1 Pinout Ball F28 G25 D29 E29 F29 G28 A27 C25 E24 D24 C24 B26 A26 B25 ...
Page 36
... Table 19. Pinout List (Continued) Ball N27 T29 R27 R26 R29 R28 W29 P28 N26 AA27 P29 AA26 N25 AA25 AB29 AB28 P25 AB27 H29 J29 J28 J27 J26 J25 K25 L29 L27 L26 L25 M29 M28 M27 M26 N29 T25 MOTOROLA ...
Page 37
... IRQ0/NMI_OUT IRQ7/INT_OUT/APE TRST TCK TMS TDI TDO TRIS PORESET HRESET SRESET QREQ RSTCONF MODCK1/AP1/TC0/BNKSEL0 MODCK2/AP2/TC1/BNKSEL1 MODCK3/AP3/TC2/BNKSEL2 MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Table 19. Pinout List (Continued) Pinout Ball U27 U26 U25 V29 V28 V27 V26 W27 W26 W25 Y29 Y28 ...
Page 38
... Table 19. Pinout List (Continued) Ball AB2 AH4 2 AC29 2 AC25 2 AE28 2 AG29 2 AG28 2 AG26 2 AE24 2 AH25 2 AF23 2 AH23 2 AE22 2 AH22 2 AJ21 2 AH20 2 AG19 2 AF18 2 AF17 2 AE16 2 AJ16 2 AG15 2 AJ13 2 AE13 2 AF12 2 AG11 2 AH9 2 AJ8 2 AH7 2 AF7 2 AD5 2 AF1 2 AD3 2 AB5 2 AD28 MOTOROLA ...
Page 39
... L1TXD2A1 PB22/FCC2_UT8_TXD7/FCC2_TXD0/FCC2_TXD/L1RXD1A1/L1RXDD2 PB23/FCC2_UT8_TXD6/FCC2_TXD1/L1RXD2A1/L1TXDD2 PB24/FCC2_UT8_TXD5/FCC2_TXD2/L1RXD3A1/L1RSYNCC2 PB25/FCC2_UT8_TXD4/FCC2_TXD3/L1TSYNCC2/L1GNTC2/L1TXD3A1 PB26/FCC2_MII_CRS/FCC2_UT8_TXD1/L1RXDC2 PB27/FCC2_MII_COL/FCC2_UT8_TXD0/L1TXDC2 PB28/FCC2_MII_RX_ER/FCC2_RTS/L1TSYNCB2/L1GNTB2/TXD1 PB29/FCC2_UTM_RXCLAV/FCC2_UTS_RXCLAV/L1RSYNCB2/ FCC2_MII_TX_EN PB30/FCC2_MII_RX_DV/FCC2_UT_TXSOC/L1RXDB2 PB31/FCC2_MII_TX_ER/FCC2_UT_RXSOC/L1TXDB2 PC0/DREQ1/BRGO7/SMSYN2/L1CLKOA2 PC1/DREQ2/BRGO6/L1RQA2 PC2/FCC3_CD/FCC2_UT8_TXD3/DONE2 PC3/FCC3_CTS/FCC2_UT8_TXD2/DACK2/CTS4 PC4/FCC2_UTM_RXENB/FCC2_UTS_RXENB/SI2_L1ST4/FCC2_CD PC5/FCC2_UTM_TXCLAV/FCC2_UTS_TXCLAV/SI2_L1ST3/FCC2_CTS PC6/FCC1_CD/L1CLKOC1/FCC1_UTM_RXADDR2/FCC1_UTS_RXADDR/ FCC1_UTM_RXCLAV1 MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Table 19. Pinout List (Continued) Pinout Ball 2 AD26 2 AD25 2 AE26 2 AH27 2 AG24 2 AH24 2 AJ24 2 AG22 ...
Page 40
... MPC826xA (HiP4) Family Hardware Specifications Table 19. Pinout List (Continued) Ball 2 AJ25 2 AF22 2 AE21 2 AF20 2 AE19 2 AE18 2 AH18 2 AH17 2 AG16 2 AF15 2 AJ15 2 AH14 2 AG13 2 AH12 2 AJ11 2 AG10 2 AE10 2 AF9 2 AE8 2 AJ6 2 AG2 2 AF3 2 AF2 2 AE1 2 AD1 2 AC28 2 AD27 2 AF29 2 AF28 2 AG25 2 AH26 2 AJ27 MOTOROLA ...
Page 41
... PD25/RXD3/FCC1_UT16_TXD6/L1TXDD1 PD26/RTS2/TENA2/FCC1_UT16_RXD6/L1RSYNCC1 PD27/TXD2/FCC1_UT16_RXD7/L1RXDC1 PD28/RXD2/FCC1_UT16_TXD7/L1TXDC1 PD29/RTS1/TENA1/FCC1_UTM_RXADDR3/FCC1_UTS_RXADDR3/ FCC1_UTM_RXCLAV2/FCC2_UTM_RXADDR4 PD30/FCC2_UTM_TXENB/FCC2_UTS_TXENB/TXD1 PD31/RXD1 VCCSYN VCCSYN1 GNDSYN 1,3 CLKIN2 4 SPARE4 1,5 PCI_MODE 4 SPARE6 6 THERMAL0 6 THERMAL1 MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Table 19. Pinout List (Continued) Pinout Ball 2 AJ23 2 AG23 2 AJ22 2 AE20 2 AJ20 2 AG18 2 AG17 2 AF16 2 AH15 ...
Page 42
... M2, Y1, Y2, AC1, AC2, AH19, AJ19, AH10, AJ10, AJ5 AA5, AF21, AF14, AF8, AE7, AF11, AE17, AE23, AC26, AB25, Y26, V25, T26, R25, P26, M25, K27, H25, G26, D7, D10, D14, D16, D20, D23, C9, E11, E13, E15, E19, E22, B3, G5, H4, K5, M3, P5, T4, Y5, AA2, AC3 Meaning MOTOROLA ...
Page 43
... Package Parameters Package parameters are provided in Table 21. The package type is a 37.5 x 37.5 mm, 480-lead TBGA. Package Outline Interconnects Pitch Nominal unmounted package height 1.55 mm MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Table 21. Package Parameters Parameter 37.5 x 37.5 mm 480 ( ball array) 1.27 mm ...
Page 44
... A. 4. Primary data A and the seating plane are defined by the spherical crowns of the solder balls. Millimeters Dim Min Max A 1.45 1.65 A1 0.60 0.70 A2 0.85 0.95 A3 0.25 — b 0.65 0.85 D 37.50 BSC D1 35.56 REF e 1.27 BSC E 37.50 BSC E1 35.56 REF MOTOROLA ...
Page 45
... Ordering Information Figure 16 provides an example of the Motorola part numbering nomenclature for the MPC826xA. In addition to the processor frequency, the part numbering scheme also consists of a part modifier that indicates any enhancement(s) in the part from the original production design. Each part number also contains a revision code that refers to the die mask revision number and is specifi ...
Page 46
... SPICLK to PC19. They are documented correctly in the parallel I/O ports chapter in the MPC8260 PowerQUICC II™ Family Reference Manual but had previously been omitted from Table 19. 46 MPC826xA (HiP4) Family Hardware Specifications Substantive Changes and θ and θ and θ MOTOROLA ...
Page 47
... THIS PAGE INTENTIONALLY LEFT BLANK MOTOROLA MPC826xA (HiP4) Family Hardware Specifications Document Revision History 47 ...
Page 48
... Motorola was negligent regarding the design or manufacture of the part. Motorola and the Stylized M Logo are registered in the U.S. Patent and Trademark Office. digital dna is a trademark of Motorola, Inc. All other product or service names are the property of their respective owners. Motorola, Inc Equal Opportunity/Affi ...