MC68HC705C8ACS

Manufacturer Part NumberMC68HC705C8ACS
ManufacturerFreescale Semiconductor, Inc
MC68HC705C8ACS datasheet
 
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Freescale Semiconductor, Inc.
14.8 42-Pin Shrink Dual In-Line Package (SDIP)
-A-
42
1
-T-
SEATING
PLANE
G
F
D
42 PL
0.25 (0.010)
T A
M
Figure 14-6. MC68HC705C8AB Package Dimensions (Case #858)
MC68HC705C8A — Rev. 3
MOTOROLA
For More Information On This Product,
42-Pin Shrink Dual In-Line Package (SDIP)
22
-B-
21
L
H
C
N
M
K
J
42 PL
0.25 (0.010)
T B
M
S
S
Mechanical Specifications
Go to: www.freescale.com
Mechanical Specifications
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
A
1.435
1.465
36.45
37.21
B
0.540
0.560
13.72
14.22
C
0.155
0.200
3.94
5.08
D
0.014
0.022
0.36
0.56
F
0.032
0.046
0.81
1.17
G
0.070 BSC
1.778 BSC
H
0.300 BSC
7.62 BSC
J
0.008
0.015
0.20
0.38
K
0.115
0.135
2.92
3.43
0.600 BSC
15.24 BSC
L
M
0
15
0
15
N
0.020
0.040
0.51
1.02
Technical Data