UPD78P0208GF-3BA Renesas Electronics Corporation., UPD78P0208GF-3BA Datasheet

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UPD78P0208GF-3BA

Manufacturer Part Number
UPD78P0208GF-3BA
Description
Manufacturer
Renesas Electronics Corporation.
Datasheet

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Document No. U11295EJ1V0DS00 (1st edition)
(Previous No. IP-3475)
Date Published May 1996 P
Printed in Japan
of the m PD780208 is replaced with one-time PROM or EPROM.
development, manufacture of small quantities of multiple products, and fast start-up of applications.
FEATURES
PROM.
Pin compatible with mask ROM products (except for V
Internal PROM: 60K bytes
Internal high-speed RAM
Internal expansion RAM
Buffer RAM
FIP
Can be operated at the same power supply voltage as mask ROM products:
V
A/D converter’s power supply voltage: AV
QTOP
The m PD78P0208 is a product in the m PD780208 subseries within the 78K/0 series, in which on-chip mask ROM
Since user programs can be written to PROM, this microcomputer is best suited for evaluation in system
For specific functions and other detailed information, consult the following user’s manual.
This manual is required reading for design work.
Notes 1. Internal PROM capacity can be changed according to the internal memory switching register (IMS).
Remark The QTOP microcomputer is a single-chip microcomputer with a built-in one-time PROM that is totally
In this reference, all ROM components that are common to one-time PROM and EPROM are referred to as
DD
m PD78P0208KL-T : EPROM (best suited for system evaluation)
m PD78P0208GF
®
This product differs from mask ROM products in the following respects.
• It can use the same memory mapping as mask ROM products, depending upon the IMS and IXS
• FIP0 to FIP12 have on-chip pull-down resistors.
• Port 3 and FIP13 to FIP52 (port 8 to port 12) do not have on-chip pull-down resistors.
• Port 7 does not have a on-chip pull-up resistor.
= 2.7 to 5.5 V (except for A/D converter).
display RAM
TM
settings.
2. Internal expansion RAM capacity can be changed according to the internal expansion RAM switching
microcomputer
supported by NEC. The support includes writing application programs, marking, screening, and
verification.
register (IXS).
: PROM (best suited for manufacture of small quantities)
The information in this document is subject to change without notice.
8-BIT SINGLE-CHIP MICROCOMPUTER
Note 1
: 1024 bytes
: 1024 bytes
: 64 bytes
: 80 bytes
m PD780208 Subseries User’s Manual
78K/0 Series User’s Manual, Instruction : IEU-1372
The mark
Note 2
DD
DATA SHEET
= 4.0 to 5.5 V.
shows major revised points.
PP
pin)
MOS INTEGRATED CIRCUIT
m PD78P0208
: IEU-1413
©
1990
1996

Related parts for UPD78P0208GF-3BA

UPD78P0208GF-3BA Summary of contents

Page 1

SINGLE-CHIP MICROCOMPUTER The m PD78P0208 is a product in the m PD780208 subseries within the 78K/0 series, in which on-chip mask ROM of the m PD780208 is replaced with one-time PROM or EPROM. Since user programs can be written ...

Page 2

ORDERING INFORMATION Part No. m PD78P0208GF-3BA 100-pin plastic QFP m PD78P0208KL-T 100-pin ceramic WQFN 78K/0 SERIES PRODUCT DEVELOPMENT The 78K/0 series products were developed as shown below. The subseries names are indicated in frames. For control 100-pin PD78078 100-pin PD78070A ...

Page 3

The table below shows the main differences between subseries. Function ROM capacity 8-bit 16-bit Watch WDT A/D Subseries name m PD78078 For control 32K-60K m PD78070A – m PD78058F 48K-60K m PD78054 16K-60K m PD78018F 8K-60K m PD78014 8K-32K m ...

Page 4

OVERVIEW OF FUNCTIONS Item Internal memory • PROM: 60K bytes • RAM Internal high-speed RAM Internal expansion RAM Buffer RAM FIP display RAM General register 8 bits ¥ 32 registers (8 bits ¥ 8 registers ¥ 4 banks) On-chip instruction ...

Page 5

Item Vector Maskable Internal: 9, external: 4 interrupts interrupt Non-maskable Internal: 1 interrupt Software Internal: 1 interrupt Test input Internal: 1 Supply voltage V = 2 Package • 100-pin plastic QFP • 100-pin ceramic WQFN m ...

Page 6

PIN CONFIGURATION (TOP VIEW) (1) Normal operating mode • 100-pin plastic QFP (14 ¥ 20 mm) m PD78P0208GF-3BA • 100-pin ceramic WQFN (14 ¥ 20 mm) m PD78P0208KL P37 2 P36/BUZ 3 P35/PCL 4 P34/TI2 5 P33/TI1 ...

Page 7

P00-P04 : Port 0 P10-P17 : Port 1 P20-P27 : Port 2 P30-P37 : Port 3 P70-P74 : Port 7 P80-P87 : Port 8 P90-P97 : Port 9 P100-P107 : Port 10 P110-P117 : Port 11 P120-P127 : Port 12 ...

Page 8

PROM programming mode • 100-pin plastic QFP (14 ¥ 20 mm) m PD78P0208GF-3BA • 100-pin ceramic WQFN (14 ¥ 20 mm) m PD78P0208KL ( ...

Page 9

BLOCK DIAGRAM TO0/P30 16-bit TIMER/ EVENT COUNTER TI0/INTP0/P00 TO1/P31 8-bit TIMER/ TI1/P33 EVENT COUNTER1 TO2/P32 8-bit TIMER/ TI2/P34 EVENT COUNTER2 WATCHDOG TIMER WATCH TIMER SI0/SB0/P25 SERIAL SO0/SB1/P26 INTERFACE 0 SCK0/P27 SI1/P20 SO1/P21 SERIAL SCK1/P22 INTERFACE 1 STB/P23 BUSY/P24 ANI0/P10- ANI7/P17 ...

Page 10

DIFFERENCES BETWEEN THE m PD78P0208 AND MASK ROM PRODUCTS .................... 2. LIST OF PIN FUNCTIONS ........................................................................................................ 2.1 PINS FOR NORMAL OPERATING MODE .................................................................................... 2.2 PINS FOR PROM PROGRAMMING MODE .................................................................................. 2.3 I/O CIRCUITS FOR PINS AND TREATMENT OF UNUSED ...

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DIFFERENCES BETWEEN THE PD78P0208 AND MASK ROM PRODUCTS The m PD78P0208 contains an on-chip one-time PROM in which data can be written once or an EPROM featuring repetitive program write and deletion. Functions other ...

Page 12

LIST OF PIN FUNCTIONS 2.1 PINS FOR NORMAL OPERATING MODE (1) Port pins (1/2) I/O Pin name P00 Input Port 0. P01 I/O 5-bit I/O port. P02 P03 Note 1 Input P04 P10-P17 I/O Port 1. 8-bit I/O port. ...

Page 13

Port pins (2/2) Pin name I/O P70-P74 I/O Port 7. N-ch open-drain 5-bit I/O port. Each pin can be designated as an input or output pin separately. Can directly drive LEDs. P80-P87 Output Port 8. P-ch open-drain 8-bit high ...

Page 14

Non-port pins (1/2) Pin name I/O INTP0 Input Can be set for effective edge (rising edge, falling edge, or both rising and falling edges). INTP1 Inputs external interrupts. INTP2 INTP3 Falling edge detection and external interrupt input SI0 Input ...

Page 15

Non-port pins (2/2) Pin name I/O ANI0-ANI7 Input Analog input for A/D converter AV Input Reference voltage input for A/D converter REF AV — Analog power supply for A/D converter. Connect — Ground for A/D ...

Page 16

I/O CIRCUITS FOR PINS AND TREATMENT OF UNUSED PINS Table 2-1 describes the types of I/O circuits for pins and the treatment of unused pins. Fig. 2-1 shows the configuration of these various types of I/O circuits. Table 2-1 ...

Page 17

Table 2-1 Types of I/O Circuits for Pins (2/2) Pin name I/O circuit type P100/FIP29-P107/FIP36 15-B P110/FIP37-P117/FIP44 P120/FIP45-P127/FIP52 RESET 2 XT2 16 AV — REF LOAD V PP I/O Recommended connection method for unused pins ...

Page 18

Fig. 2-1 List of I/O Circuits for Pins (1/2) Type 2 IN This is a Schmitt trigger input with hysteresis characteristic. Type 5-A Pullup enable V DD Data P-ch Output N-ch disable Input enable Type 8-A Pullup enable V DD ...

Page 19

Fig. 2-1 List of I/O Circuits for Pins (2/2) Type P-ch P-ch Data N-ch Type 14 P-ch P-ch Data N-ch Type 15 P-ch Data N-ch OUT V LOAD RD ...

Page 20

INTERNAL MEMORY SWITCHING (IMS) REGISTER This register enables the software to avoid using part of the internal memory. The IMS register can be set to establish the same memory mapping as used in ROM products that have a different ...

Page 21

INTERNAL EXPANDED RAM SWITCHING (IXS) REGISTER The m PD78P0208 can set the IXS register to establish the same memory mapping as used in ROM products that have a different internal expanded RAM capacity. The IXS register is set using ...

Page 22

PROM PROGRAMMING The m PD78P0208 has an on-chip 60KB PROM device for use as program memory. When programming, set the V and RESET pins for PROM programming mode. See (2) PROM programming mode in PIN CONFIGURATION PP (TOP VIEW) ...

Page 23

Read mode Set and set read mode. (2) Output disable mode Set set high impedance for data output and output disable mode. Consequently, if several m PD78P0208 devices ...

Page 24

PROM WRITE SEQUENCE Fig. 5-1 Page Program Mode Flowchart ADDRESS = ADDRESS + 1 No Pass G = Start address N = Program end address 2 4 START ADDRESS = 6 12.5 V ...

Page 25

Fig. 5-2 Page Program Mode Timing Page data latch A2-A16 A0, A1 D0-D7 Data input 1 PGM ...

Page 26

Fig. 5-3 Byte Program Mode Flowchart ADDRESS = ADDRESS + 1 No Pass G = Start address N = Program end address 2 6 START ADDRESS = 6 12 ...

Page 27

Fig. 5-4 Byte Program Mode Timing Program A0-A16 Data input D0- 1 PGM ...

Page 28

PROM READ SEQUENCE Follow this sequence to read the PROM contents to an external data bus (D0 to D7). (1) Set the RESET pin to low level and add + the V CONFIGURATION (TOP VIEW) with regard ...

Page 29

ERASURE CHARACTERISTICS ( m PD78P0208KL-T ONLY) Data written in the m PD78P0208KL-T program memory can be erased (FFH); therefore users can write other data in the memory. To erase the written data, expose the erasure window to light with ...

Page 30

ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS (T A Symbol Parameter Supply voltage LOAD REF AV SS P01 to P04, P10 to P17, P20 to P27, P30 to P37, X1, X2, RESET Input ...

Page 31

Notes 2. Total power dissipation differs depending on the temperature (see the following figure). 800 600 400 200 –40 0 +40 +80 Temperature [°C] m PD78P0208 3 1 ...

Page 32

How to calculate total power dissipation The total power dissipation of the µPD78P0208GF is the sum of the values at the following three parts. Design your application set so that the sum is lower than the total power dissipation P ...

Page 33

PD78P0208 3 3 ...

Page 34

MAIN SYSTEM CLOCK OSCILLATION CIRCUIT CHARACTERISTICS (T Resonator Recommended circuit Ceramic resonator Crystal resonator External clock X2 X1 PD74HCU04 Notes 1. Only the oscillator characteristics are shown. See ...

Page 35

SUBSYSTEM CLOCK OSCILLATOR CHARACTERISTICS (T Resonator Recommended circuit Crystal resonator XT1 XT2 External clock XT2 XT1 Notes 1. Only the oscillator characteristics are shown. See AC characteristics for instruction execution times. 2. This is the ...

Page 36

RECOMMENDED OSCILLATOR CONSTANT Main System Clock: Ceramic Resonator (T Manufacturer Product name Murata Mfg. Co., Ltd. CSB1000J Toyama CSA2.00MG040 CST2.00MG040 CSA4.00MG CST4.00MGW CSA5.00MG CST5.00MGW TDK Corp. CCR1000K2 FCR4.00MC5 CCR4.00MC3 FCR5.00MC5 CCR5.00MC3 Matsushita Electronics EFOEC5004A4 Components Co., Ltd. EFOEN5004A4 EFOS5004B5 Caution ...

Page 37

CAPACITANCE ( ° Parameter Symbol Input capacitance MHz Unmeasured pins returned Output capacitance MHz Unmeasured pins returned ...

Page 38

DC CHARACTERISTICS (T = –40 to +85 ° Parameter Symbol High-level input P21, P23 V IH1 voltage V P00 to P03, P20, P22, P24 to P27, P33, P34, RESET IH2 V P70 to P74 IH3 V X1, X2 ...

Page 39

DC CHARACTERISTICS (T = –40 to +85 ° Parameter Symbol Low-level input LIL1 IN leakage current I LIL2 I LIL3 I LIL4 High-level input LOH1 OUT DD leakage current ...

Page 40

AC CHARACTERISTICS (1) Basic operation (T = –40 to +85 ° Parameter Symbol Cycle time (mini- T Operated with main system CY mum) instruction clock execution time) Operated with subsystem clock TI1, TI2 input 4.5 ...

Page 41

Serial interface (T = –40 to +85 ° (a) Serial interface channel 0 (i) 3-wire serial I/O mode (SCK0: Internal clock output) Parameter Symbol SCK0 cycle time 4.5 to 5.5 V KCY1 DD V ...

Page 42

SBI mode (SCK0: Internal clock output) Parameter Symbol SCK0 cycle time t V KCY3 DD SCK0 high, low-level t V KH3 DD width t KL3 SB0, SB1 setup time t V SIK3 DD to SCK0• SB0, SB1 hold time ...

Page 43

I/O mode (SCK0: Internal clock output) Parameter Symbol SCK0 cycle time t KCY5 SCK0 high-level width t KH5 SCK0 low-level width 4.5 to 5.5 V KL5 DD SB0, SB1 setup time ...

Page 44

Serial interface channel 1 (i) 3-wire serial I/O mode (SCK1: Internal clock output) Parameter Symbol SCK1 cycle time t V KCY7 SCK1 high, low-level t V KH7 width t KL7 SI1 setup time to SCK1• SIK7 SI1 ...

Page 45

I/O mode with automatic transmit/receive function (SCK1: Internal clock output) Parameter Symbol SCK1 cycle time t V KCY9 DD SCK1 high, low-level t V KH9 DD width t KL9 SI1 setup time (to SCK1• SIK9 ...

Page 46

AC Timing Test Point (Excluding X1, XT1 Input Clock Timing X1 Input XT1 Input TI Timing TI1, TI2 Test Points 0 1 ...

Page 47

Serial Transfer Timing 3-wire serial I/O mode (fx = 5.0 MHz, fxx = MHz DD DD SCK0, SCK11 SI0, SI1 t KSO1, 2, SO0, SO1 SBI mode (bus release signal transfer): SCK0 t t KSB SBL SB0, ...

Page 48

I/O mode: SCK0 t KSO5, 6 SB0, SB1 3-wire serial I/O mode with automatic transmit/receive function: SO1 D2 D1 SI1 KSI9, 10 SIK9 KH9 KSO9, 10 SCK1 t R10 t ...

Page 49

A/D CONVERTER CHARACTERISTICS (T Parameter Symbol Resolution Note 1 Total error Note 2 Conversion time t CONV Note 3 Sampling time t SAMP Analog signal input voltage V IAN Reference voltage AV REF AV resistor R REF AIREF Notes 1. ...

Page 50

Data Retention Timing (Standby Release Signal: STOP Mode Release by Interrupt Signal STOP instruction execution Standby release signal (interrupt request) Interrupt Input Timing INTP0 - INTP2 INTP3 RESET Input Timing RESET 5 0 HALT mode STOP mode Data ...

Page 51

PROM PROGRAMMING CHARACTERISTICS DC Characteristics (1) PROM write mode ( ±5 ° Parameter Symbol Symbol Input voltage high V IH Input voltage low V IL Output voltage high V OH Output voltage low V OL Input ...

Page 52

AC Characteristics (1) PROM write mode (a) Page program mode ( ±5 ° Parameter Symbol Address setup time (to OEØ) OE setup time CE setup time (to OEØ) Input data setup time (to OEØ) Address hold ...

Page 53

PROM read mode ( ±5 ° Parameter Symbol Data output delay time from address (fx = 5.0 MHz, fxx = MHz DD DD Data output delay time from CEØ Data output delay ...

Page 54

PROM Write Mode Timing (Page Program Mode) Page data latch A2 - A16 AHL A0 Hi Data input t VPS VDS V ...

Page 55

PROM Write Mode Timing (Byte Program Mode) Program A0 - A16 t AS Hi-Z Data input VPS VDS V ...

Page 56

PROM Programming Mode Setting Timing RESET A16 SMA Effective address m PD78P0208 ...

Page 57

CHARACTERISTIC CURVE (REFERENCE VALUE) 10.0 5.0 1.0 0.5 0.1 0.05 0.01 0.005 0.001 vs. V (Main system clock: 5.0 MHz PCC = 00H PCC = 01H PCC = 02H PCC = 03H PCC ...

Page 58

I vs Clock oscillation frequency f [MHz PD78P0208 = 25 ...

Page 59

V vs. I (Port 0.5 1.0 Low-level output voltage vs. I (Ports ...

Page 60

V vs. I (Port ° 0.5 ...

Page 61

vs. I (Port 0 - Port – – 0.5 1.0 High-level ...

Page 62

PACKAGE DRAWINGS 100 PIN PLASTIC QFP (14 20 100 NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of its true position (T.P.) at maximum material condition ...

Page 63

PIN CERAMIC WQFN NOTE Each lead centerline is located within 0.06 mm (0.003 inch) of its true position (T.P.) at maximum material condition X100KW-65A-1 ITEM MILLIMETERS INCHES 20.6 ± 0.4 0.811 ± 0.016 ...

Page 64

RECOMMENDED SOLDERING CONDITIONS The conditions listed below shall be met when soldering the m PD78P0208. For details of the recommended soldering conditions, refer to our document Semiconductor Device Mounting Technology Manual (C10535E). Please consult with our sales offices in ...

Page 65

APPENDIX A DEVELOPMENT TOOLS The following tools are available for development of systems using the m PD78P0208. Language processing software Notes RA78K/0 Notes CC78K/0 Notes DF780208 Notes 1, ...

Page 66

Fuzzy inference development support system Note 1 Note 3 FE9000 /FE9200 Note 1 Note 2 FT9080 /FT9085 FI78K0 Notes 1, 2 Notes 1, 2 FD78K0 Notes 1. PC-9800 series (MS-DOS) based 2. IBM PC/AT and compatible (PC DOS/IBM DOS/MS-DOS) based ...

Page 67

Conversion socket (EV-9200GF-100) package drawings and recommended pattern to mount the socket Fig. A-1 Package Drawings of EV-9200GF-100 (Reference) (Unit: mm) Based on EV-9200GF-100 (1) Package drawing (in mm EV-9200GF-100 1 No.1 pin index ...

Page 68

Fig. A-2 Recommended Pattern to Mount EV-9200GF-100 on a Substrate (Reference) (Unit: mm) Based on EV-9200GF-100 (2) Pad drawing (in mm) ITEM MILLIMETERS A 26.3 B 21.6 0.65 ± 0.02 29=18.85 ± 0.05 C 0.65 ± 0.02 19=12.35 ± 0.05 ...

Page 69

APPENDIX B RELATED DOCUMENTS Documents related to devices Document name m PD780208 Subseries User’s Manual m PD780204, 780205, 780206, 780208 Data Sheet 78K/0 Series User’s Manual, Instruction 78K/0 Series Instruction Set 78K/0 Series Instruction Summary Sheet m PD780208 Subseries Special ...

Page 70

Documents related to embedded software (user’s manual) Document name 78K/0 Series Real-time OS 78K/0 Series OS MX78K0 Tool for Creating Fuzzy Knowledge Data 78K/0, 78K/II, and 87AD Series Fuzzy Inference Development Support System, Translator 78K/0 Series Fuzzy Inference Development Support ...

Page 71

Cautions on CMOS Devices Countermeasures against static electricity for all MOSs Caution When handling MOS devices, take care so that they are not electrostatically charged. Strong static electricity may cause dielectric breakdown in gates. When transporting or storing MOS devices, ...

Page 72

Some related documents may be preliminary versions. Note that, however, what documents are preliminary is not indicated in this document. The export of these products from Japan is regulated by the Japanese government. The export of some or all of ...

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