ISPLSI5256VE-100LF256 Lattice Semiconductor Corp., ISPLSI5256VE-100LF256 Datasheet

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ISPLSI5256VE-100LF256

Manufacturer Part Number
ISPLSI5256VE-100LF256
Description
Manufacturer
Lattice Semiconductor Corp.
Datasheet

Specifications of ISPLSI5256VE-100LF256

Dc
04+

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Manufacturer
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Part Number:
ISPLSI5256VE-100LF256-80I
Manufacturer:
LATTICE
Quantity:
20 000
Company:
Part Number:
ISPLSI5256VE-100LF256-80I
Quantity:
130
Part Number:
ISPLSI5256VE-100LF256C
Manufacturer:
LATTICE
Quantity:
303
• Second Generation SuperWIDE HIGH DENSITY
• HIGH PERFORMANCE E
• IN-SYSTEM PROGRAMMABLE
• 100% IEEE 1149.1 BOUNDARY SCAN TESTABLE AND
• ARCHITECTURE FEATURES
Copyright © 2002 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
5256ve_10
Features
IN-SYSTEM PROGRAMMABLE LOGIC DEVICE
— 3.3V Power Supply
— User Selectable 3.3V/2.5V I/O
— 12000 PLD Gates / 256 Macrocells
— Up to 144 I/O Pins
— 256 Registers
— High-Speed Global Interconnect
— SuperWIDE Generic Logic Block (32 Macrocells) for
— SuperWIDE Input Gating (68 Inputs) for Fast
— PCB Efficient Ball Grid Array (BGA) Package Options
— Interfaces with Standard 5V TTL Devices
— TTL/3.3V/2.5V Compatible Input Thresholds and
— Electrically Erasable and Reprogrammable
— Non-Volatile
— Programmable Speed/Power Logic Path Optimization
— Increased Manufacturing Yields, Reduced Time-to-
— Reprogram Soldered Devices for Faster Debugging
3.3V IN-SYSTEM PROGRAMMABLE
— Enhanced Pin-Locking Architecture with Single-
— Wrap Around Product Term Sharing Array Supports
— Macrocells Support Concurrent Combinatorial and
— Macrocell Registers Feature Multiple Control
— Four Dedicated Clock Input Pins Plus Macrocell
— Programmable I/O Supports Programmable Bus
— Four Global Product Term Output Enables, Two
Market, and Improved Product Quality
Optimum Performance
Counters, State Machines, Address Decoders, etc.
f
t
Output Levels
Level Global Routing Pool and SuperWIDE GLBs
up to 35 Product Terms Per Macrocell
Registered Functions
Options Including Set, Reset and Clock Enable
Product Term Clocks
Hold, Pull-up, Open Drain and Slew Rate Options
Global OE Pins and One Product Term OE per
Macrocell
max = 165 MHz Maximum Operating Frequency
pd = 6.0 ns Propagation Delay
2
CMOS
®
TECHNOLOGY
1
The ispLSI 5000VE Family of In-System Programmable
High Density Logic Devices is based on Generic Logic
Blocks (GLBs) of 32 registered macrocells and a single
Global Routing Pool (GRP) structure interconnecting the
GLBs.
Outputs from the GLBs drive the Global Routing Pool
(GRP) between the GLBs. Switching resources are pro-
vided to allow signals in the Global Routing Pool to drive
any or all the GLBs in the device. This mechanism allows
fast, efficient connections across the entire device.
Each GLB contains 32 macrocells and a fully populated,
programmable AND-array with 160 logic product terms
and three extra control product terms. The GLB has 68
inputs from the Global Routing Pool which are available
in both true and complement form for every product term.
The 160 product terms are grouped in 32 sets of five and
sent into a Product Term Sharing Array (PTSA) which
allows sharing up to a maximum of 35 product terms for
a single function. Alternatively, the PTSA can be by-
passed for functions of five product terms or less. The
three extra product terms are used for shared controls:
reset, clock, clock enable and output enable.
Functional Block Diagram
ispLSI 5000VE Description
3.3V SuperWIDE™ High Density PLD
Logic Block
Logic Block
Generic
Generic
Input Bus
Input Bus
ispLSI
Global Routing Pool
In-System Programmable
(GRP)
Logic Block
Logic Block
Generic
Generic
Input Bus
Input Bus
®
5256VE
January 2002
Boundary
Interface
Scan

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ISPLSI5256VE-100LF256 Summary of contents

Page 1

... Global OE Pins and One Product Term OE per Macrocell Copyright © 2002 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. ...

Page 2

Functional Block Diagram Figure 1. ispLSI 5256VE Functional Block Diagram (144-I/O Option) VCCIO 1 TOE I/O 1 I/O 2 I/O 3 I/O 14 I/O 15 I/O 16 I/O 17 I/O 18 I/O 19 I/O 20 I/O 21 I/O 32 I/O ...

Page 3

Description (Continued) The 32 registered macrocells in the GLB are driven by the 32 outputs from the PTSA or the PTSA bypass. Each macrocell contains a programmable XOR gate, a pro- grammable register/latch and the necessary clocks and ...

Page 4

Figure 2. ispLSI 5256VE Block Diagram (144 I/O Version CLK2 I 160 3 160 160 CLK3 I 160 3 160 ...

Page 5

Figure 3. ispLSI 5000VE Generic Logic Block (GLB) From GRP ...

Page 6

Figure 4. ispLSI 5000VE Macrocell PTOE GOE0 GOE1 TOE PT Clock PT Reset Shared PT Reset PT Preset speed/ power Note: Not all macrocells have I/O pads. Specifications ispLSI 5256VE Global PTOE 0 Global PTOE 1 Global PTOE 2 Global ...

Page 7

Global Clock Distribution The ispLSI 5000VE Family has four dedicated clock input pins: CLK0 - CLK3. CLK0 input is used as the dedicated master clock that has the lowest internal clock skew with no clock inversion to maintain the fastest ...

Page 8

Figure 6. Boundary Scan Register Circuit for I/O Pins SCANIN BSCAN (from previous Registers cell Shift DR Clock DR Figure 7. Boundary Scan Register Circuit for Input-Only Pins Input Pin SCANIN ...

Page 9

Figure 8. Boundary Scan Waveforms and Timing Specifications TMS TDI T btch TCK TDO Data to be captured Data to be driven out SYMBOL PARAMETER t btcp TCK [BSCAN test] clock pulse width t btch TCK [BSCAN test] pulse width ...

Page 10

Absolute Maximum Ratings Supply Voltage V .................................. -0.5 to +5.4V cc Input Voltage Applied ............................... -0.5 to +5.6V Tri-Stated Output Voltage Applied ........... -0.5 to +5.6V Storage Temperature ................................ -65 to 150°C Case Temp. with Power Applied .............. -55 to ...

Page 11

Switching Test Conditions Input Pulse Levels Input Rise and Fall Time Input Timing Reference Levels Ouput Timing Reference Levels Output Load 3-state levels are measured 0.5V from steady-state active level. Output Load Conditions (See Figure 9) 3.3V TEST CONDITION R1 ...

Page 12

DC Electrical Characteristics for 2.5V Range SYMBOL PARAMETER V I/O Reference Voltage CCIO V Input Low Voltage IL V Input High Voltage IH V Output Low Voltage OL V Output High Voltage OH 1. I/O voltage configuration must be set ...

Page 13

External Switching Characteristics ...

Page 14

External Switching Characteristics ...

Page 15

Internal Timing Parameters PARAMETER DESCRIPTION In/Out Delays t in Input Buffer Delay t gclk_in Global Clock Buffer Input Delay (clk0) t rst Global Reset Pin Delay t goe Global OE Pin Delay t buf Output Buffer Delay t en Output ...

Page 16

Timing Parameters (continued) BASE PARAMETER ADDER TYPE Routing Adders route Tioi Input Adders t clk1 gclk_in t clk2 gclk_in t clk3 gclk_in 1 Tioo Output Adders t t Slow Slew I/O buf ...

Page 17

Timing Model From Feedback t ROUTE t BLA INREG t GCLK_IN CLK t IOI t RST RST t OE GOE In/Out Delays Note: Italicized parameters are delay adders above and beyond default ...

Page 18

Power Consumption Power consumption in the ispLSI 5256VE device de- pends on two primary factors: the speed at which the device is operating and the number of product terms used. The product terms have a fuse-selectable speed/ power tradeoff setting. ...

Page 19

Signal Descriptions Signal Name TMS Input - This pin is the Test Mode Select input, which is used to control the JTAG state machine. TCK Input - This pin is the Test Clock input pin used to clock through the ...

Page 20

Pin Configuration ispLSI 5256VE 100-Pin TQFP (0.5mm Lead Pitch / 14.0mm x 14.0mm Body Size GND 6 I VCC 8 I ...

Page 21

Pin Configuration ispLSI 5256VE 128-Pin TQFP (0.4mm Lead Pitch / 14.0mm x 14.0mm Body Size GND 7 I VCC 9 ...

Page 22

Signal Configuration ispLSI 5256VE 256-Ball fpBGA (1.0mm Ball Pitch / 17.0mm x 17.0mm Body Size I/O I/O I/O I/O I/O A 113 116 121 125 126 I/O I/O I/O I/O I/O 119/ B 108 115 ...

Page 23

Signal Configuration ispLSI 5256VE 272-Ball BGA (1.27mm Ball Pitch / 27.0mm x 27.0mm Body Size I/O I/O I/O I/O 119 114 115 126 CLK2 I/O I/O I ...

Page 24

Part Number Description ispLSI 5256VE Device Family Device Number Speed f 165 = 165 MHz max f 125 = 125 MHz max f 100 = 100 MHz max MHz max Ordering Information FAMILY fmax (MHz) tpd ...

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