DTC114TE Motorola, DTC114TE Datasheet
DTC114TE
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DTC114TE Summary of contents
Page 1
... These digital transistors are designed to replace a single device and its external resistor bias network. The BRT eliminates these individual components by integrating them into a single device. The DTC114TE is housed in the SOT–416/SC–90 package which is ideal for low power surface mount applications where board space premium ...
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... DTC114TE MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection TYPICAL SOLDERING PATTERN Unit: mm SOT–416/SC–90 POWER DISSIPATION The power dissipation of the SOT– ...
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... C 160 C 150 C SOLDER IS LIQUID FOR SECONDS 140 C (DEPENDING ON 100 C MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES Figure 1. Typical Solder Heating Profile DTC114TE STEP 6 STEP 7 VENT COOLING 205 TO 219 C PEAK AT SOLDER JOINT T MAX 3 ...
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... Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 0.70 0.80 0.028 0.031 B 1.40 1.80 0.055 0.071 C 0.60 0.90 0.024 0.035 D 0.15 0.30 0.006 0.012 G 1.00 BSC 0.039 BSC H ––– 0.10 ––– 0.004 J 0.10 0.25 0.004 0.010 K 1.45 1.75 0.057 0.069 L 0.10 0.20 0.004 0.008 S 0.50 BSC 0.020 BSC *DTC114TE/D* DTC114TE/D ...