MSM514400DL-60SJ Oki Semiconductor, MSM514400DL-60SJ Datasheet
MSM514400DL-60SJ
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MSM514400DL-60SJ Summary of contents
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... CMOS technology. The MSM514400D/DL achieves high integration, high-speed operation, and low-power consumption because Oki manufactures the device in a quadruple-layer polysilicon/ single-layer metal CMOS process. The MSM514400D/DL is available in a 26/20-pin plastic SOJ, 20- pin plastic ZIP, or 26/20-pin plastic TSOP. The MSM514400DL (the low-power version) is specially designed for lower-power applications. FEATURES • ...
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Semiconductor PIN CONFIGURATION (TOP VIEW) DQ1 1 DQ2 RAS 26/20-Pin Plastic SOJ CAS DQ3 ...
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Semiconductor BLOCK DIAGRAM Timing RAS Generator CAS Column 10 Address Buffers Internal Refresh Address Control Clock Counter Row Row Address 10 10 De- Buffers coders Chip V Generator Timing Generator ...
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Semiconductor ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Parameter Voltage on Any Pin Relative Short Circuit Output Current Power Dissipation Operating Temperature Storage Temperature Recommended Operating Conditions Parameter Power Supply Voltage Input High Voltage Input Low Voltage Capacitance ...
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Semiconductor DC Characteristics Parameter Symbol Output High Voltage Output Low Voltage £ V Input Leakage Current I All other pins not LI under test = disable ...
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Semiconductor AC Characteristics (1/2) Parameter Random Read or Write Cycle Time Read Modify Write Cycle Time Fast Page Mode Cycle Time Fast Page Mode Read Modify Write Cycle Time Access Time from RAS Access Time from CAS Access Time ...
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Semiconductor AC Characteristics (2/2) Parameter Read Command Set-up Time Read Command Hold Time Read Command Hold Time referenced to RAS Write Command Set-up Time Write Command Hold Time Write Command Hold Time from RAS Write Command Pulse Width OE ...
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Semiconductor Notes start-up delay of 200 s is required after power-up, followed by a minimum of eight initialization cycles (RAS-only refresh or CAS before RAS refresh) before proper device operation is achieved. 2. The AC characteristics assume ...
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E2G0094-17-41G ¡ Semiconductor TIMING WAVEFORM Read Cycle V – IH RAS V – CRP V – IH CAS V – ASR RAH V – ...
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Semiconductor Read Modify Write Cycle V – IH RAS – CRP V – IH CAS – RAH ASR V – ...
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Semiconductor Fast Page Mode Read Cycle V – IH RAS – CRP V – IH CAS – ASR V – IH Row Address – V ...
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Semiconductor Fast Page Mode Read Modify Write Cycle V t – IH RAS AR V – RCD V – IH CAS t RAD V – RAH t ...
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Semiconductor CAS before RAS Refresh Cycle – IH RAS V – RPC t CP CAS V – – – – OFF – ...
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Semiconductor Hidden Refresh Write Cycle V – IH RAS V – CRP V – IH CAS V – IL ...
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Semiconductor PACKAGE DIMENSIONS SOJ26/20-P-300-1.27 Mirror finish Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and ...
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Semiconductor ZIP20-P-400-1.27 Mirror finish MSM514400D/DL (Unit : mm) Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating Solder plate thickness more Package weight (g) 1.50 TYP. 16/17 ...
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Semiconductor TSOPII26/20-P-300-1.27-K Mirror finish Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed ...