AD7112 Analog Devices, AD7112 Datasheet - Page 4

• Manufacturer Part Number: AD7112
• Description: Dual CMOS Multiplying DAC with Anti-Log Transfer Function for Audio Volume Control Applications
• Manufacturer: Analog Devices

Specifications of AD7112

• Resolution (bits): 17bit
• Dac Update Rate: 222kSPS
• Dac Settling Time: n/a
• Max Pos Supply (v): +5.25V
• Single-supply: Yes
• Dac Type: Current Out
• Dac Input Format: Par

AD7112
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7112 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
TERMINOLOGY
RESOLUTION: Nominal change in attenuation when moving
between two adjacent codes.
MONOTONICITY: The device is monotonic if the analog out-
put decreases or remains constant as the wdigital code in-
creases.
FEEDTHROUGH ERROR: That portion of the input signal
which reaches the output when all digital inputs are high.
OUTPUT CAPACITANCE: Capacitance from OUT A or
OUT B to ground.
GAIN ERROR: Gain error results from a mismatch between
R
Its effect in a LOGDAC is to produce a constant additive at-
tenuation error in dB over the whole range of the DAC.
ACCURACY: The difference (measured in dB) between the
ideal transfer function as listed in Table I and the actual trans-
fer function as measured with the device.
DIGITAL-TO-ANALOG GLITCH IMPULSE: The amount
of charge injected from the digital inputs to the analog output
when the inputs change state. This is normally specified as the
area of the glitch in either pA-s or nV-s depending on whether
the glitch is measured as a current or voltage signal. Glitch im-
pulse is measured with V
Model
AD7112BN
AD7112CN
AD7112BR
AD7112CR
*N = Plastic DIP; R = SOIC.
ABSOLUTE MAXIMUM RATINGS*
V
AGND to DGND . . . . . . . . . . . . . . . . . . –0.3 V, V
Digital Inputs to DGND . . . . . . . . . . . . . –0.3 V, V
OUT A, OUT B to AGND . . . . . . . . . . . –0.3 V, V
V
V
Operating Temperature Range
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150 C
Storage Temperature . . . . . . . . . . . . . . . . . –65 C to +150 C
Power Dissipation, DIP . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W
JA
FB
DD
IN
RFB
All Versions . . . . . . . . . . . . . . . . . . . . . . . . –40 C to +85 C
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 102 C/W
(the feedback resistance) and the R-2R ladder resistance.
A, V
to AGND or DGND . . . . . . . . . . . . . . . . . . –0.3 V, +7 V
A, V
IN
RFB
B to AGND . . . . . . . . . . . . . . . . . . . . . . . . . 25 V
B to AGND . . . . . . . . . . . . . . . . . . . . . . . 25 V
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
Temperature
Range
ORDERING INFORMATION
IN
= AGND.
Specified
Accuracy
Range
0 dB to 60 dB
0 dB to 72 dB
0 dB to 60 dB
0 dB to 72 dB
DD
DD
DD
Package
Option*
N-20
N-20
R-20
R-20
+ 0.3 V
+ 0.3 V
+ 0.3 V
–4–
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . +300 C
Power Dissipation, SOIC . . . . . . . . . . . . . . . . . . . . . . . . . 1 W
Lead Temperature (Soldering)
*Stresses above those listed under “Absolute Maximum Ratings” may cause
Pin
1
2
3
4
5
6
7–14 DB7–DB0
15
16
17
18
19
20
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability. Only
one Absolute Maximum Rating may be applied at any one time.
JA
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . . . 215 C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 C
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75 C/W
Mnemonic
AGND
OUT A
R
V
DGND
DAC A/
DAC B
CS
WR
V
V
R
OUT B
IN
DD
IN
FB
FB
A
B
A
B
DAC A/DAC B
PIN FUNCTION DESCRIPTION
(MSB) DB7
OUT A
PIN CONFIGURATION
AGND
DGND
R
V
FB
DB6
DB5
DB4
IN
Description
Analog Ground.
Current Output Terminal of DAC A.
Feedback Resistor for DAC A.
Reference Input to DAC A
Digital Ground.
Selects Which DAC Can Accept Data from
Input Port.
8 Data Inputs.
Chip Select Input, Active Low.
Write Input, Active Low.
Power Supply Input 5 V
Reference Input to DAC B.
Feedback Resistor for DAC B.
Current Output Terminal of DAC B.
A
A
10
2
4
5
7
8
9
1
3
6
DIP/SOIC
(Not to Scale)
TOP VIEW
AD7112
WARNING!
19
17
14
11
20
18
16
15
13
12
R
V
V
DB0 (LSB)
OUT B
WR
CS
DB1
DB2
DB3
FB
IN
DD
ESD SENSITIVE DEVICE
B
B
5%.
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