ADA4850-1 Analog Devices, ADA4850-1 Datasheet - Page 5

• Manufacturer Part Number: ADA4850-1
• Description: High Speed, Rail-to-Rail Output Op Amp with Ultralow Power Down
• Manufacturer: Analog Devices

Specifications of ADA4850-1

• -3db Bandwidth: 175MHz
• Slew Rate: 220V/µs
• Vos: 600µV
• Ib: 2.3µA
• # Opamps Per Pkg: 1
• Input Noise (nv/rthz): 10nV/rtHz
• Vcc-vee: 2.7V to 6V
• Isy Per Amplifier: 2.9mA
• Packages: CSP

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Power Dissipation
Power Down Pin Voltage
Common-Mode Input Voltage
Differential Input Voltage
Storage Temperature
Operating Temperature Range
Lead Temperature Range
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
specified for the device soldered in the circuit board for
surface-mount packages.
Table 4.
Package Type
16-Lead LFCSP
8-Lead LFCSP
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4850-1/
ADA4850-2 is limited by the associated rise in junction
temperature (T
is the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature limit
may change the stresses that the package exerts on the die,
permanently shifting the parametric performance of the
ADA4850-1/ADA4850-2. Exceeding a junction temperature
of 150°C for an extended period of time can result in changes
in silicon devices, potentially causing degradation or loss of
functionality.
JA
(Soldering 10 sec)
is specified for the worst-case conditions, that is, θ
J
) on the die. At approximately 150°C, which
Rating
12.6 V
See Figure 4
(−V
(−V
+V
−65°C to +125°C
−40°C to +125°C
300°C
150°C
θ
91
80
JA
S
S
S
to −V
+ 6) V
− 0.5 ) V to (+V
S
Unit
°C/W
°C/W
JA
S
is
+ 0.5) V
Rev. B | Page 5 of 16
The power dissipated in the package (P
cent power dissipation and the power dissipated in the die due
to the ADA4850-1/ADA4850-2 drive at the output. The
quiescent power is the voltage between the supply pins (V
times the quiescent current (I
RMS output voltages should be considered. If R
to −V
V
the worst case, when V
In single-supply operation with R
case is V
Airflow increases heat dissipation, effectively reducing θ
Also, more metal directly in contact with the package leads and
exposed paddle from metal traces through holes, ground, and
power planes reduce θ
Figure 4 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the LFCSP (91°C/W)
package on a JEDEC standard 4-layer board. θ
approximations.
ESD CAUTION
Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
S
× I
P
2.5
2.0
1.5
1.0
0.5
P
P
S
OUT
D
0
D
, as in single-supply operation, the total drive power is
D
–55
= Quiescent Power + (Total Drive Power − Load Power)
OUT
=
=
. If the rms signal levels are indeterminate, consider
–45 –35 –25 –15 –5
(
(
V
V
= V
LFCSP-16
S
S
×
×
S
I
I
/2.
S
S
)
)
+
+
AMBIENT TEMPERATURE (°C)
⎛
⎜
⎜
⎝
(
JA
V
V
OUT
2
.
5
S
R
S
/
L
15 25 35 45 55 65 75 85 95 105 115
4
×
= V
ADA4850-1/ADA4850-2
)
V
2
LFCSP-8
S
R
OUT
).
S
/4 for R
L
L
⎞
⎟
⎟
⎠
referenced to −V
−
D
V
) is the sum of the quies-
L
OUT
R
to midsupply.
L
2
JA
L
values are
is referenced
S
, the worst
125
JA
.
S
)