ADP1706 Analog Devices, ADP1706 Datasheet - Page 15

• Manufacturer Part Number: ADP1706
• Description: 1 A, Low Dropout, CMOS Linear Regulator
• Manufacturer: Analog Devices

PCB LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP1706/ADP1707/ADP1708. However, as can be seen from
Table 5, a point of diminishing returns is eventually reached,
beyond which an increase in the copper size does not yield
significant heat dissipation benefits.
The ADP1706/ADP1707/ADP1708 feature an exposed pad on
the bottom of both the SOIC and LFCSP packages to improve
thermal performance. Because the exposed pad is electrically
connected to GND inside the package, it is recommended that
it also be connected to the ground plane on the PCB with a
sufficient amount of copper.
Here are a few general tips when designing PCBs:
•
•
•
•
Place the input capacitor as close as possible to the IN and
GND pins.
Place the output capacitor as close as possible to the OUT
and GND pins.
For the ADP1706, place the soft start capacitor as close as
possible to the SS pin.
Connect the load as close as possible to the OUT and
SENSE pins.
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Use of 0402 or 0603 size capacitors and resistors achieves the
smallest possible footprint solution on boards where area is
limited.
GND
GND
VIN
ADP1706/ADP1707/ADP1708
C1
ADP1706/ADP1707/ADP1708
J1
Figure 42. Example PCB Layout
EN
C3
U1
SOIC8
ANALOG
DEVICES
ADJ/TRK/SS
R2
R1
C2
VOUT
GND
GND