MCP6544-E/SL Microchip Technology, MCP6544-E/SL Datasheet - Page 28

IC COMP 1.6V QUAD P-P 14SOIC

MCP6544-E/SL

Manufacturer Part Number
MCP6544-E/SL
Description
IC COMP 1.6V QUAD P-P 14SOIC
Manufacturer
Microchip Technology
Type
General Purposer
Datasheets

Specifications of MCP6544-E/SL

Output Type
CMOS, Push-Pull, Rail-to-Rail, TTL
Package / Case
14-SOIC (0.154", 3.90mm Width)
Number Of Elements
4
Voltage - Supply
1.6 V ~ 5.5 V
Mounting Type
Surface Mount
Number Of Channels
4 Channels
Product
Analog Comparators
Offset Voltage (max)
7 mV
Input Bias Current (max)
0.000001 uA
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
MCP6541/1R/1U/2/3/4
DS21696F-page 28
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1 2
b
D
Dimension Limits
e
E1
A2
E
Units
c
A2
A1
E1
L1
N
A
E
D
e
L
b
c
L1
0.80
0.05
4.30
4.90
0.45
0.09
0.19
MIN
MILLIMETERS
0.65 BSC
6.40 BSC
1.00 REF
NOM
1.00
4.40
5.00
0.60
14
Microchip Technology Drawing C04-087B
© 2007 Microchip Technology Inc.
MAX
1.20
1.05
0.15
4.50
5.10
0.75
0.20
0.30
L

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