BZV55_SER NXP Semiconductors, BZV55_SER Datasheet

Low-power voltage regulator diodes in small hermetically sealed glass SOD80CSurface-Mounted Device (SMD) packages

BZV55_SER

Manufacturer Part Number
BZV55_SER
Description
Low-power voltage regulator diodes in small hermetically sealed glass SOD80CSurface-Mounted Device (SMD) packages
Manufacturer
NXP Semiconductors
Datasheet
1. Product profile
2. Pinning information
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
Low-power voltage regulator diodes in small hermetically sealed glass SOD80C
Surface-Mounted Device (SMD) packages. The diodes are available in the normalized
E24 2 % (BZV55-B) and approximately 5 % (BZV55-C) tolerance range.
The series consists of 37 types with nominal working voltages from 2.4 V to 75 V.
Table 1.
[1]
Table 2.
[1]
Symbol
V
P
Pin
1
2
F
ZSM
BZV55 series
Voltage regulator diodes
Rev. 5 — 26 January 2011
Non-repetitive peak reverse power
dissipation:  40 W
Total power dissipation:  500 mW
Two tolerance series: 2 % and 5 %
General regulation functions
t
The marking band indicates the cathode.
p
= 100 s; square wave; T
Parameter
forward voltage
non-repetitive peak
reverse power dissipation
Quick reference data
Pinning
cathode
anode
Description
j
= 25 C prior to surge
Conditions
I
F
= 10 mA
[1]
Wide working voltage range:
nominal 2.4 V to 75 V (E24 range)
Low differential resistance
Small hermetically sealed glass
SMD package
Simplified outline
k
[1]
Min
-
-
a
Typ
-
-
Product data sheet
Graphic symbol
1
Max
0.9
40
006aaa152
Unit
V
W
2

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BZV55_SER Summary of contents

Page 1

BZV55 series Voltage regulator diodes Rev. 5 — 26 January 2011 1. Product profile 1.1 General description Low-power voltage regulator diodes in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) packages. The diodes are available in the normalized E24 2 ...

Page 2

... Device mounted on a ceramic substrate of 10  10  0.6 mm. [2] 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) Device mounted on a ceramic substrate of 10  10  0.6 mm. [1] BZV55_SER Product data sheet Ordering information Package Name Description - hermetically sealed glass surface-mounted [1] package; 2 connectors Marking codes Limiting values ...

Page 3

... Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table 7.  Symbol BZV55_SER Product data sheet Characteristics C unless otherwise specified. Parameter forward voltage reverse current BZV55-B/C2V4 BZV55-B/C2V7 BZV55-B/C3V0 BZV55-B/C3V3 ...

Page 4

... B 8.04 8.36 C 7.7 8.7 9V1 B 8.92 9.28 C 8.5 9 9.8 10.2 C 9.4 10 10.8 11.2 C 10.4 11 11.8 12.2 C 11.4 12.7 BZV55_SER Product data sheet Differential resistance Temperature r () coefficient dif Typ Max Typ Max Min 3.5 275 600 70 100 3.5 300 600 75 100 3.5 325 600 ...

Page 5

... B 21.6 22.4 C 20.8 23 23.5 24.5 C 22.8 25.6 [ MHz 100 s; square wave C prior to surge [ BZV55_SER Product data sheet …continued Differential resistance Temperature r () coefficient dif Typ Max Typ Max Min 50 170 ...

Page 6

... C 58.0 66 66.6 69.4 C 64.0 72 73.5 76.5 C 70.0 79.0 [ MHz 100 s; square wave C prior to surge [ BZV55_SER Product data sheet Differential resistance Temperature r () coefficient dif 0 Typ Max Typ Max Min 65 300 ...

Page 7

... S Z (mV/K) −1 −2 − BZV55-B/C2V4 to BZV55-B/C4V3 = 25 C to 150  Fig 4. Temperature coefficient as a function of working current; typical values BZV55_SER Product data sheet mbg801 (1) ( (ms) p Fig 3. mbg783 4V3 (mV/K) 3V9 3V6 3V3 3V0 2V4 ...

Page 8

... Fig 6. 9. Packing information Table 10. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BZV55-B2V4 to BZV55-C75 [1] For further information and the availability of packing methods, see BZV55_SER Product data sheet 0.3 3.7 3.3 Dimensions in mm Package outline SOD80C Packing methods Package ...

Page 9

... NXP Semiconductors 10. Soldering Fig 7. 2.90 Fig 8. BZV55_SER Product data sheet 4.55 4.30 2.30 2.25 1.70 1.60 0.90 (2x) Reflow soldering footprint SOD80C 6.30 4.90 2.70 1.90 1.70 Wave soldering footprint SOD80C All information provided in this document is subject to legal disclaimers. Rev. 5 — 26 January 2011 BZV55 series Voltage regulator diodes solder lands solder paste solder resist occupied area ...

Page 10

... Product data sheet Product specification Product specification Product specification All information provided in this document is subject to legal disclaimers. Rev. 5 — 26 January 2011 BZV55 series Voltage regulator diodes Change notice Supersedes - BZV55_SER v.4 for R th(j-t) th(j-sp) CPCN200508022F BZV55 v.3 - BZV55 v.2 - BZV55 v © NXP B.V. 2011. All rights reserved. ...

Page 11

... Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or BZV55_SER Product data sheet [3] Definition This document contains data from the objective specification for product development. ...

Page 12

... NXP Semiconductors’ warranty of the 13. Contact information For more information, please visit: For sales office addresses, please send an email to: BZV55_SER Product data sheet product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ ...

Page 13

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 26 January 2011 Document identifier: BZV55_SER ...

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