LMV331SQ3T2G ON Semiconductor, LMV331SQ3T2G Datasheet - Page 15
LMV331SQ3T2G
Manufacturer Part Number
LMV331SQ3T2G
Description
IC COMPARATOR GP LV SINGLE SC-70
Manufacturer
ON Semiconductor
Type
General Purposer
Datasheet
1.LMV331SQ3T2G.pdf
(21 pages)
Specifications of LMV331SQ3T2G
Number Of Elements
1
Output Type
Open Drain
Voltage - Supply
2.7 V ~ 5 V
Mounting Type
Surface Mount
Package / Case
6-TSSOP (5 lead), SC-88A, SOT-353
Product
Analog Comparators
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LMV331SQ3T2G
Manufacturer:
ON
Quantity:
15 000
Company:
Part Number:
LMV331SQ3T2G
Manufacturer:
ON Semiconductor
Quantity:
1 950
Part Number:
LMV331SQ3T2G
Manufacturer:
ON/安森美
Quantity:
20 000
2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
1.0
C A B
0.037
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
J
CASE 483−02
K
ISSUE H
TSOP−5
0.074
1.9
DETAIL Z
15
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
M
A
B
C
D
G
H
K
L
S
J
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_