ADV7162KS170 Analog Devices Inc, ADV7162KS170 Datasheet - Page 42

• Manufacturer Part Number: ADV7162KS170
• Description: IC DAC VIDEO COLOR 96BIT 160MQFP
• Manufacturer: Analog Devices Inc
• Type: Video DACr

Specifications of ADV7162KS170

• Rohs Status: RoHS non-compliant
• Applications: HDTV
• Mounting Type: Surface Mount
• Package / Case: 160-MQFP, 160-PQFP

ADV7160/ADV7162
The ADV7160/ADV7162 is a very highly integrated monolithic
silicon device. This high level of integration, in such a small
package, inevitably leads to consideration of thermal and envi-
ronmental conditions which the ADV7160/ADV7162 must op-
erate in. Reliability of the device is enhanced by keeping it as
cool as possible. In order to avoid destructive damage to the de-
vice, the absolute maximum junction temperature of 150 C
must never be exceeded. Certain applications, depending on
ambient temperature and pixel data rates may require forced air
cooling or external heatsinks. The following data is intended as
a guide in evaluating the operating conditions of a particular ap-
plication so that optimum device and system performance is
achieved.
It should be noted that information on package characteristics
published herein may not be the most up to date at the time of
reading this. Advances in package compounds and manufacture
will inevitably lead to improvements in the thermal data. Please
contact your local sales office for the most up-to-date information.
Power Dissipation
The diagrams show graphs of power dissipation in watts versus
pixel clock frequency for the ADV7160 and ADV7162. When
using the ADV7162 in Bypass Mode, the Pixel Mask Register
should be programmed to 00H to reduce power further.
Package Characteristics
The tables of thermal characteristics show typical information
for the ADV7160 (160-Lead Plastic Power QFP) and AD7162
(160-Lead Plastic QFP) using various values of Airflow.
Junction-to-Case (
part is:
(Note:
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
Typical Power Dissipation vs. Pixel Rate
JC
JC
60
(AD7160) = 0.4 C/W
(AD7162) = 6.7 C/W
Note:
The "Worst Case On-Screen Pattern" corresponds
to full-scale transition on each pixel value for
every CLOCK edge (00H, FFH, 00H, ...).
The "Typical On-Screen Pattern" corresponds to
linear changes in tne pixel input (i.e., a Black to White Ramp).
In general, color images tend to approximate this characteristic.
V
V
T
JC
AA
REF
A
JC
= +25 C
is independent of airflow.)
100
= +5V
) Thermal Resistance for this particular
= +1.2V
PIXEL CLOCK FREQUENCY – MHz
140
THERMAL AND ENVIRONMENTAL CONSIDERATIONS
180
220
ADV7160
ADV7162
260
APPENDIX 7
–42–
Heatsinks
The maximum silicon junction temperature should be limited to
100 C. Temperatures greater than this will reduce long-term
device reliability. To ensure that the silicon junction tempera-
ture stays within prescribed limits, the addition of an external
heatsink may be necessary. Heatsinks will reduce
in the Thermal Characteristics vs. Airflow table.
Air Velocity
(Linear Feet/min
*These figures do not include thermal conduction through the package leads
Air Velocity
(Linear Feet/min)
*These figures do not include thermal conduction through the package leads
Thermal Model
The junction temperature of the device in a specific application
is given by:
or
where:
T
T
P
Package Enhancements for ADV7160
The standard PQFP package has been enhanced to a
PowerQuad2 package. This supports an improved thermal
performance compared to standard PQFP. In this case, the die
is attached to a heat slug so that the power that is dissipated can
be conducted to the external surface of the package. This pro-
vides a highly efficient path for the transfer of heat to the pack-
age surface. The package configuration also provides and efficient
thermal path from the ADV7160 to the Printed Circuit Board.
into the PCB. Thermal conduction through the leads can provide up to
10
into the PCB. Thermal conduction through the leads can provide up to
5
JA
JA
JC
CA
JA
D
J
A
o
No Heatsink
EG&G D10100-28 Heatsink
Thermalloy 2290 Heatsink
No Heatsink
EG&G D10850-40 Heatsink
EG&G D10851-36 Heatsink
C/W reduction in
Table A. Thermal Characteristics vs. Airflow–ADV7160*
Table B. Thermal Characteristics vs. Airflow–ADV7162*
= Junction Temperature of Silicon ( C)
o
= Junction to Ambient Thermal Resistance ( C/W)
= Power Dissipation (W)
= Junction to Case Thermal Resistance ( C/W)
= Ambient Temperature ( C)
C/W reduction in
= Case to Ambient Thermal Resistance ( C/W)
C/W
C/W
T
T
J
J
= T
= T
JA
JA
.
A
A
.
+ P
+ P
D
D
(
(
JC
JA
)
+
0
(Still Air)
25.5
23
19
0
(Still Air)
37
28
32
CA
)
50
23
20
17
50
32
24
24
JA
21
18
22
19
100
15
100
30
as shown
REV. 0
200
19
16
12
200
28
19
14
(1)
(2)