NESL157B Nichia, NESL157B Datasheet - Page 14

• Manufacturer Part Number: NESL157B
• Manufacturer: Nichia

Specifications of NESL157B

• Size Lxwxh (mm): 3.0x1.4x0.52
• Lumi-nous Inten-sity Typ(cd): 5.4
• Lumi-nous Flux Typ(lm)): 16.0
• Ra Min: 80
• Forward Voltage Vf(v) Typ: 2.90
• Forward Voltage Vf(v) Max: 3.10
• Directivity (degree): 120
• If (ma): 50
• Mounting Style: Through Hole

RELIABILITY
(1) Tests and Results
(2) Failure Criteria
NOTES:
U.S.L. : Upper Specification Limit
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Temperature Cycle
Moisture Resistance
(Cyclic)
High Temperature
Storage
Temperature Humidity
Storage
Low Temperature
Storage
Room Temperature
Operating Life
Condition 1
Room Temperature
Operating Life
Condition 2
High Temperature
Operating Life
Temperature Humidity
Operating Life
Low Temperature
Operating Life
Vibration
Electrostatic Discharges
Soldering Joint Shear
Strength
#1
#2
Criteria #
1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, R
2) Measurements are performed after allowing the LEDs to return to room temperature.
Test
Forward Voltage(V
Luminous Flux(Φ
Solderability
Items
JEITA ED-4701
300 301
JEITA ED-4701
303 303A
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
JEITA ED-4701
400 403
JEITA ED-4701
300 304
JEITA ED-4702B
002 3
Reference
Standard
V
L.S.L. : Lower Specification Limit
)
F
)
I
I
-
F
F
=50mA
=50mA
T
Precondition: 30°C, 70%RH, 168hr
T
Lead-free Solder(Sn-3.0Ag-0.5Cu)
-40°C(30min)~25°C(5min)~
100°C(30min)~25°C(5min)
25°C~65°C~-10°C, 90%RH,
24hr per cycle
T
T
T
T
Test board: See NOTES below
T
Test board: See NOTES below
T
Test board: See NOTES below
60°C, RH=90%, I
Test board: See NOTES below
T
Test board: See NOTES below
200m/s
4cycles, 4min, each X, Y, Z
HBM, 2kV, 1.5kΩ, 100pF, 3pulses,
alternately positive or negative
5N, 10±1sec
Conditions
sld
sld
A
A
A
A
A
A
A
=100°C
=60°C, RH=90%
=-40°C
=25°C, I
=25°C, I
=100°C, I
=-40°C, I
=260°C, 10sec, 2reflows,
=245±5°C, 5sec,
2
, 100~2000~100Hz,
Test Conditions
F
F
=50mA
=90mA
F
F
=50mA
=60mA
F
>U.S.L.×1.1
<L.S.L.×0.7
Less than 95% solder coverage
=50mA
Failure Criteria
θJA
≈95°C/W
100cycles
10cycles
1000hours
1000hours
1000hours
1000hours
500hours
1000hours
500hours
1000hours
48minutes
Duration
Test
Criteria
Failure
#1
#2
#1
#1
#1
#1
#1
#1
#1
#1
#1
#1
#1
#1
#1
#
Failed/Tested
Units
0/22
0/22
0/50
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
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