NHSL157A-H3 Nichia, NHSL157A-H3 Datasheet - Page 6

• Manufacturer Part Number: NHSL157A-H3
• Manufacturer: Nichia

Specifications of NHSL157A-H3

• Size Lxwxh (mm): 3.0x1.4x0.52
• Lumi-nous Inten-sity Typ(cd): 2.1
• Lumi-nous Flux Typ(lm)): 6.0
• Ra Min: 80
• Forward Voltage Vf(v) Typ: 3.10
• Forward Voltage Vf(v) Max: 3.40
• Directivity (degree): 120
• If (ma): 20
• Mounting Style: Through Hole

SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
● Recommended Soldering Pad Pattern
* The product is designed to be reflow soldered to a PCB. If you use dip soldering for the products,
* Reflow soldering must not be performed more than twice. Manual soldering must only be done once.
* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.
* Customer is advised to use nitrogen reflow soldering as air flow process can cause optical degradation
* Since silicone used as encapsulating resin in this product is a soft material, do not press on the encapsulant.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
* When soldering, avoid applying any stress to the LED package while heated.
Nichia cannot guarantee its reliability.
due to the heat and atmosphere of reflow soldering.
Failure to comply might lead to nicks, chip-outs, delamination and deformation of the encapsulant, wire breakage
and an adverse effect on product reliability.
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
1 to 5°C per sec
0.6
Pre-heat
180 to 200°C
120sec Max
1.66
60sec Max
Above 220°C
0.5
0.64
260°C Max
10sec Max
0.6
● Recommended Metal Solder Stencil Aperture
• Recommended Manual Soldering Condition
0.6
0.8
Temperature
Soldering Time
1.56
2.4
350°C Max
3sec Max
0.7
0.54
0.8
0.6
(単位 Unit: mm)
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