NSDW570GS-K1

Manufacturer Part NumberNSDW570GS-K1
ManufacturerNichia
NSDW570GS-K1 datasheet
 


Specifications of NSDW570GS-K1

Size Lxwxh (mm)Round 5.0Lumi-nous Flux Typ(lm))28.0
Forward Voltage Vf(v) Typ3.40Forward Voltage Vf(v) Max3.70
Directivity (degree)140If (ma)70
Mounting StyleThrough Hole  
1
Page 1
2
Page 2
3
Page 3
4
Page 4
5
Page 5
6
Page 6
7
Page 7
8
Page 8
9
Page 9
10
Page 10
11
12
13
14
15
16
Page 6/16

Download datasheet (225Kb)Embed
PrevNext
SOLDERING
• Recommended Hand Soldering Condition
Temperature
350°C Max
Soldering Time
3sec Max
No closer than 3mm from
Position
the base of the lens.
* For a better thermal performance, copper alloy is used for the leadframe of the product.
Care must be taken for the soldering conditions and handling of the products after soldering.
* Solder the LED no closer than 3mm from the base of the lens.
Soldering beyond the base of the tie bar is recommended.
* Dip soldering/hand soldering must not be performed more than once.
* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.
* When soldering, do not apply stress to the lead frame while the LED is hot.
* After soldering, the LED position must not be corrected.
* After soldering, NO mechanical shock or vibration should be applied to LED lens
until the LEDs cool down to room temperature.
* In order to avoid damage on the lens during cutting and clinching the leads,
it is not recommended to solder the LEDs directly on customer PCB without any gap between the lens and the board.
If it is unavoidable, customer is advised to check whether such soldering will not cause wire breakage or lens damage.
Direct soldering to double-sided PCBs must be avoided due to an increased effect of heat on the lens.
* When it is necessary to clamp the LEDs to prevent soldering failure,
it is important to minimize the mechanical stress on the LEDs.
* Cut the LED lead frames at room temperature. Cutting the lead frames at high temperature may cause failure of the LEDs.
• Recommended Dip Soldering Condition
Pre-Heat
120°C Max
Pre-Heat Time
60sec Max
Solder Bath
260°C Max
Temperature
Dipping Time
10sec Max
No closer than 3mm from
Dipping Position
the base of the lens.
5