NSSM016D Nichia, NSSM016D Datasheet - Page 14

• Manufacturer Part Number: NSSM016D
• Manufacturer: Nichia

Specifications of NSSM016D

• Size Lxwxh (mm): 5.5x5.5x2.5
• Lumi-nous Inten-sity Typ(cd): 400
• Forward Voltage Vf(v) Typ: 3.20
• Forward Voltage Vf(v) Max: 3.50
• Directivity (degree): 115
• If (ma): 20
• Mounting Style: Through Hole

CAUTIONS
(1) Storage
(2) Directions for Use
(3) Handling Precautions
(4) Design Consideration
● This product is compliant to JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for the details of the moisture sensitivity levels.
● Interface delamination can occur due to vaporization and expansion of absorbed moisture
● After opening the moisture-proof aluminum bag, the products should be completed soldering process
● After the "Period After Opening" specified above, or if the desiccants (silica gel) are no longer blue, the products need to be baked.
● The leads or electrode pads (anode and cathode) of the product are plated with silver. Exposure to a corrosive environment
● To avoid condensation, the products must not be stored in the areas where temperature and humidity fluctuate greatly.
● In designing a circuit, the current through each LED die must not exceed the Absolute Maximum Rating current
● When having the two or more dice within this product on at the same time, the total power dissipation for the LED package
● This product should be operated in forward bias. A driving circuit must be designed
● For stabilizing the LED characteristics, it is recommended to operate at 10% of the rated current or higher.
● Care must be taken to ensure that the reverse voltage will not exceed the Absolute Maximum Rating
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
● When handling the product, do not touch it directly with bare hands as it may contaminate the surface
● When handling the product with tweezers, make sure that excessive force is not applied to the resin portion of the product.
● If the product is dropped, it might be damaged.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
● PCB warpage after mounting the products onto a PCB can cause the package to break.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
● Board separation must be performed using special jigs, not with hands.
Storage
Baking
in the LED packages caused by soldering heat, which may result in degradation in optical performance.
To minimize moisture absorption into the products during the transportation and storage, the products are packed
in a moisture-proof aluminum bag. Desiccants (silica gel) inside the packing turn from blue to red as it absorbs moisture.
within the range of the conditions above. If unused LEDs remain, they should be stored with desiccants (silica gel)
in hermetically sealed container. Nichia recommends using the original moisture-proof bag for storage.
Note that baking must only be done once.
might cause the silver plated the leads or electrode pads to tarnish, and thus leading to difficulties in soldering.
If unused LEDs remain, they must be stored in a hermetically sealed container.
Nichia recommends using the original moisture-proof bag for storage.
specified for each die.
It is recommended that each LED die is driven at a constant current.
must be within the absolute maximum value specified in this specification.
so that the product is not subjected to either forward or reverse voltage while it is off. In particular,
if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage.
when using the LEDs with matrix drive.
and affect on optical characteristics. In the worst cases, excessive force to the product might result in catastrophic failure
due to package damage and/or wire breakage.
Failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed,
and wire to be broken, and thus resulting in catastrophic failure.
delaminated and/or deformed, and wire to be broken, and thus resulting in catastrophic failure.
The LEDs should be placed so as to minimize the stress on the LEDs due to PCB bow and twist.
The LEDs should be placed so as to minimize the stress on the LEDs due to board flexing.
Before Opening Aluminum Bag
After Opening Aluminum Bag
Conditions
≤30°C
≤30°C
65±5°C
Temperature
≤90%RH
≤70%RH
-
Humidity
Within 1 Year from Delivery Date
≤168hours
≥24hours
Time
13