NSSW064A Nichia, NSSW064A Datasheet - Page 6

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NSSW064A

Manufacturer Part Number
NSSW064A
Description
Manufacturer
Nichia
Datasheet

Specifications of NSSW064A

Size Lxwxh (mm)
3.5x2.8x2.0
Lumi-nous Inten-sity Typ(cd)
3.3
Forward Voltage Vf(v) Typ
2.90
Forward Voltage Vf(v) Max
3.30
Directivity (degree)
115
If (ma)
30
Mounting Style
Through Hole

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SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
• Recommended Soldering Pad Pattern
* This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
* When soldering, do not apply stress to the LED while the LED is hot.
caused by heat and/or atmosphere.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
1 to 5°C per sec
Blank boxes: Solder resist opening , Shaded areas: Footprint
Pre-heat
180 to 200°C
120sec Max
4
1.5
60sec Max
Above 220°C
9.5
1.5
4
260°C Max
10sec Max
(単位 Unit: mm)
• Recommended Hand Soldering Condition
Temperature
Soldering Time
350°C Max
3sec Max
5

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