PIC16F88

Manufacturer Part NumberPIC16F88
ManufacturerMicrochip Technology Inc.
PIC16F88 datasheet
 
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PIC16F87/88
20-Lead Plastic Shrink Small Outline (SS) – 209 mil Body, 5.30 mm (SSOP)
E
E1
p
B
n
c
Dimension Limits
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
DS30487C-page 210
D
2
1
A
f
L
A1
Units
INCHES
MIN
NOM
MAX
n
20
p
.026
A
-
-
.079
A2
.065
.069
.073
A1
.002
-
-
E
.291
.307
.323
E1
.197
.209
.220
D
.272
.283
.289
L
.022
.030
.037
c
.004
-
.010
f
B
.009
-
.015
A2
MILLIMETERS*
MIN
NOM
MAX
20
0.65
-
-
2.00
1.65
1.75
1.85
0.05
-
-
7.40
7.80
8.20
5.00
5.30
5.60
.295
7.20
7.50
0.55
0.75
0.95
0.09
-
0.25
0.22
-
0.38
Revised 11/03/03
 2005 Microchip Technology Inc.