UPD4712C Renesas Electronics Corporation., UPD4712C Datasheet
UPD4712C
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UPD4712C Summary of contents
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The PD4712C and 4712D are high-voltage silicon gate CMOS line driver/reciever conforming to the EIA/TIA-232-E standard. It can operate with a single +5 V power source because it is provided with a DC-DC converter. In addition, this line driver/receiver has ...
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BLOCK DIAGRAM/PIN CONFIGURATION (Top View) + Bypass D IN1 capasitor D IN2 TTL/CMOS INPUT D IN3 D IN4 Output control D CON R OUT1 R TTL/CMOS OUT2 OUTPUT R OUT3 R ...
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TRUTH TABLE Drivers STBY CON IN OUT Standby mode (DC-DC converter stops Mark level output Space level output Mark level output ...
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ABSOLUTE MAXIMUM RATINGS (T Parameter Symbol Supply voltage V CC Driver input voltage D IN Receiver input voltage R IN Driver output voltage D OUT Receiver output voltage R OUT Receiver input current I IN Operating temperature range T A ...
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ELECTRICAL CHARACTERISTICS (DRIVER) (Unless otherwise specified Parameter Symbol Low-level input voltage V IL High-level input voltage V IH Low-level input current I IL High-level input current I IH Output voltage V DO Output short current I SC Slew ...
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Note 5. Test Point 5 V Standby input 1 Driver output – DAZ Do not perform communication within the standby output transition time t the standby mode. ELECTRICAL CHARACTERISTICS ...
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Note 7. Test Point Receiver input V TYP –5 t PLH V OH Receiver output 1 Note 8. Test Point 5 V Standby input 1 ...
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TEST CIRCUIT Driver output voltage/Output current (+ side) + Driver output voltage/Output current (– side) + DC- ...
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PACKAGE DRAWINGS 28PIN PLASTIC DIP (400 mil NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" ...
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PIN PLASTIC SOP (375 mil NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. 10 PD4712C/4712D 15 detail of lead end ...
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RECOMMENDED SOLDERING CONDITIONS Soldering the PD4712C and 4712D under the conditions listed in the table below is recommended. For soldering methods and conditions other than those recommended, consult NEC. Surface mount type For the details of the recommended soldering conditions ...
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