NL27WZ16DTT1G ON Semiconductor, NL27WZ16DTT1G Datasheet - Page 6

• Manufacturer Part Number: NL27WZ16DTT1G
• Description: IC BUFFER DUAL NON-INVERT 6TSOP
• Manufacturer: ON Semiconductor
• Series: 27WZr

Specifications of NL27WZ16DTT1G

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 2
• Number Of Bits Per Element: 1
• Current - Output High, Low: 32mA, 32mA
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-74-6
• Logic Family: LCX
• Number Of Channels Per Chip: 2
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 32 mA
• Low Level Output Current: 32 mA
• Maximum Power Dissipation: 200 mW
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 2 / 2
• Propagation Delay Time: 4.6 ns at 3.3 V, 3.8 ns at 5 V
• Supply Voltage Range: 1.65V To 5.5V
• Logic Case Style: TSOP
• No. Of Pins: 6
• Operating Temperature Range: -55°C To +125°C
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Family Type: 27WZ
• Input Type: 3-State
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NL27WZ16DTT1GOS; NL27WZ16DTT1GOS; NL27WZ16DTT1GOSTR

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0.05
NOTE 5
E1
A1
É É É
É É É
e
1
6
2
5
D
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
3
4
b
E
A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
c
DETAIL Z
L
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
DETAIL Z
SOLDERING FOOTPRINT*
H
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
3.20
M
http://onsemi.com
RECOMMENDED
CASE 318G−02
L2
C
GAUGE
PLANE
ISSUE U
TSOP−6
SEATING
PLANE
DIMENSIONS: MILLIMETERS
6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
0.95
PITCH
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
0.60
6X
0.95
6X
DIM
A1
E1
L2
A
D
M
b
c
E
e
L
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
MIN
0°
MILLIMETERS
0.25 BSC
NOM
1.00
0.06
0.38
0.18
3.00
2.75
1.50
0.95
0.40
−
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.10
0.10
0.50
0.26
3.10
3.00
1.70
1.05
0.60
10°
NL27WZ16/D