CMH05 TOSHIBA Semiconductor CORPORATION, CMH05 Datasheet

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CMH05

Manufacturer Part Number
CMH05
Description
Toshiba High Efficiency Rectifier Silicon Epitaxial Type
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

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Switching Mode Power Supply Applications
Absolute Maximum Ratings
Electrical Characteristics
Repetitive peak reverse voltage: V
Average forward current: I
Low forward voltage: V
Very fast reverse-recovery time: trr = 50 ns (max.)
Suitable for compact assembly due to its small surface-mount
package, the “M−FLAT
Repetitive peak reverse voltage
Average forward current
Peak one-cycle surge forward current
(non-repetitive)
Junction temperature
Storage temperature range
Note 1: Tℓ=131°C Device mounted on a ceramic board
Note 2: Using continuously under heavy loads (e.g. the application of
Peak forward voltage
Peak repetitive reverse current
Reverse recovery time
Forward recovery time
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to lead)
Characteristics
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are
within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Characteristics
Board size: 50 mm × 50 mm
Soldering land: 2 mm ×2 mm
Board thickness: 0.64t
TOSHIBA High Efficiency Rectifier Silicon Epitaxial Type
TM
FM
” (Toshiba package name)
F (AV)
= 1.3 V (max.)
(Ta = 25°C)
= 1.0 A
RRM
Symbol
V
V
R
R
(Ta = 25°C)
I
FM (1)
FM (2)
th (j-a)
RRM
th (j-ℓ)
Symbol
t
t
I
V
rr
fr
F (AV)
I
T
FSM
RRM
T
= 400 V
stg
j
CMH05
I
I
V
I
I
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 t)
FM
FM
F
F
RRM
= 1 A, di/dt = −30 A/μs
= 1.0 A
= 0.1 A (pulse test)
= 1.0 A (pulse test)
20 (50 Hz)
−40~150
−40~150
= 400 V (pulse test)
1.0 (Note 1)
Rating
400
1
Test Condition
Unit
°C
°C
V
A
A
Weight: 0.023 g (typ.)
JEDEC
JEITA
TOSHIBA
Min
Typ.
0.83
1.1
3-4E1A
2006-11-08
Max
100
135
210
1.3
10
50
60
16
CMH05
Unit: mm
°C/W
°C/W
Unit
μA
ns
ns
V

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CMH05 Summary of contents

Page 1

... A A JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) Min Typ. Max ⎯ ⎯ 0.83 ⎯ 1.1 1.3 ⎯ ⎯ 10 ⎯ ⎯ 50 ⎯ ⎯ 100 ⎯ ⎯ 60 ⎯ ⎯ 135 ⎯ ⎯ 210 ⎯ ⎯ 16 2006-11-08 CMH05 Unit: mm Unit V μ °C/W °C/W ...

Page 2

... Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance value. Refer to the Rectifier databook for further information. Unit: mm 1.4 2 CMH05 2006-11-08 ...

Page 3

... Device mounted on a ceramic board: board size × 50 mm, soldering land: 2.0 mm × 2.0 mm, board thickness: 0.64 t 0.1 0 Time t (s) 3 CMH05 P – (AV) F (AV) 0.4 0.6 0.8 1.0 1.2 (A) F (AV) Ta max – (AV) Device mounted on a glass-epoxy board: board size × ...

Page 4

... C – 100 Ta = 25° MHz Reverse voltage V (V) R (Typ 100 4 CMH05 Surge forward current (non-repetitive 25° 100 Number of cycles 2006-11-08 ...

Page 5

... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 CMH05 20070701-EN 2006-11-08 ...

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