TD62384AFG TOSHIBA Semiconductor CORPORATION, TD62384AFG Datasheet
TD62384AFG
Available stocks
Related parts for TD62384AFG
TD62384AFG Summary of contents
Page 1
... DIP−18 pin Package type−AFG : SOP−18 pin TYPE V TD62384APG / AFG −20 V~V TD62385APG / AFG 0 V~V Pin Connection (top view) TD62384APG TD62385APG TD62384AFG TD62385AFG Weight IN (ON) DIP18−P−300−2.54D : 1.47 g (Typ.) SOP18−P−375−1.27 : 0.41 g (Typ.) − 2 − 3 TD62384,385APG/AFG 2006-06-14 ...
Page 2
Schematics (each driver) TD62384APG / AFG Note : The input and output parasitic diodes cannot be used as clamp diodes. Absolute Maximum Ratings CHARACTERISTIC Supply Voltage Output Sustaining Voltage Output Current Input Voltage Input Current APG Power Dissipation AFG Operating ...
Page 3
Electrical Characteristic (Ta = 25°C) CHARACTERISTIC OutputLeakage Current Output Saturation Voltage (Output On) Input Current (Output Off) TD62384 Input Voltage (Output on) TD62385 Supply Current Turn−On Delay Turn−Off Delay TEST CIR− SYMBOL TEST CONDITION CUIT ...
Page 4
Test Circuit 1. I CEX (ON (ON OFF Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, t ≤ Note 2: ...
Page 5
TD62384APG/AFG TD62384APG/AFG TD62384,385APG/AFG TD62385APG/AFG ① ② 5 TD62385APG/AFG Type-APG Free Air Type-AFG Free Air 2006-06-14 ...
Page 6
Package Dimensions DIP18−P−300−2.54D Weight: 1.47 g (Typ.) TD62384,385APG/AFG 6 Unit: mm 2006-06-14 ...
Page 7
Package Dimensions SOP18−P−375−1.27 Weight: 0.41 g (Typ.) TD62384,385APG/AFG 7 Unit: mm 2006-06-14 ...
Page 8
Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the ...
Page 9
Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...
Page 10
About solderability, following conditions were confirmed • Solderability (1) Use of Sn-37Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use ...