M74LCX16244DTR2G ON Semiconductor, M74LCX16244DTR2G Datasheet

IC BUFF TRI-ST 16BIT LV 48TSSOP

M74LCX16244DTR2G

Manufacturer Part Number
M74LCX16244DTR2G
Description
IC BUFF TRI-ST 16BIT LV 48TSSOP
Manufacturer
ON Semiconductor
Series
74LCXr
Datasheet

Specifications of M74LCX16244DTR2G

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
8
Current - Output High, Low
8mA, 8mA
Voltage - Supply
2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
48-TSSOP
Logic Family
LCX
Number Of Channels Per Chip
16
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
High Level Output Current
- 24 mA
Low Level Output Current
24 mA
Maximum Power Dissipation
200 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
16 / 3
Output Type
3-State
Propagation Delay Time
5.2 ns at 2.7 V, 4.5 ns at 3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
M74LCX16244DTR2GOS
MC74LCX16244DTR2G
MC74LCX16244DTR2GOS
MC74LCX16244DTR2GOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M74LCX16244DTR2G
Manufacturer:
ON Semiconductor
Quantity:
4 050
Part Number:
M74LCX16244DTR2G
Manufacturer:
ON/安森美
Quantity:
20 000
MC74LCX16244
Low-Voltage CMOS
16-Bit Buffer
With 5 V−Tolerant Inputs and Outputs
(3−State, Non−Inverting)
buffer operating from a 2.3 to 3.6 V supply. The device is nibble
controlled. Each nibble has separate Output Enable inputs which can
be tied together for full 16−bit operation. High impedance TTL
compatible inputs significantly reduce current loading to input drivers
while TTL compatible outputs offer improved switching noise
performance. A V
inputs to be safely driven from 5.0 V devices. The MC74LCX16244 is
suitable for memory address driving and all TTL level bus oriented
transceiver applications.
applications. Current drive capability is 24 mA at the outputs. The
Output Enable (OEn) inputs, when HIGH, disable the outputs by
placing them in a HIGH Z condition.
3−state 5.0 V−tolerant outputs. The device is nibble controlled with
each nibble functioning identically, but independently. The control
pins may be tied together to obtain full 16−bit operation. The 3−state
outputs are controlled by an Output Enable (OEn) input for each
nibble. When OEn is LOW, the outputs are on. When OEn is HIGH,
the outputs are in the high impedance state.
Features
*For additional information on our Pb−Free strategy and soldering details, please
© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 7
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
The MC74LCX16244 is a high performance, non−inverting 16−bit
The 4.5 ns maximum propagation delays support high performance
The MC74LCX16244 contains sixteen non−inverting buffers with
Substantially Reduces System Power Requirements
Designed for 2.3 V to 3.6 V V
4.5 ns Maximum t
5.0 V Tolerant − Interface Capability With 5.0 V TTL Logic
Supports Live Insertion and Withdrawal
I
LVTTL Compatible
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current in All Three Logic States (20 mA)
Latchup Performance Exceeds 500 mA
ESD Performance: Human Body Model >2000 V;
These are Pb−Free Devices*
OFF
Specification Guarantees High Impedance When V
I
specification of 5.5 V allows MC74LCX16244
pd
Machine Model >200 V
CC
Operation
CC
1
= 0 V
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
48
ORDERING INFORMATION
48
1
A
WL
YY
WW
G
MARKING DIAGRAM
1
http://onsemi.com
LCX16244G
AWLYYWW
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
Publication Order Number:
CASE 1201
DT SUFFIX
TSSOP−48
MC74LCX16244/D

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M74LCX16244DTR2G Summary of contents

Page 1

... ESD Performance: Human Body Model >2000 V; Machine Model >200 V • These are Pb−Free Devices* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 7 http://onsemi.com ...

Page 2

OE1 OE2 GND 4 45 GND GND GND ...

Page 3

... ORDERING INFORMATION Device MC74LCX16244DTG M74LCX16244DTR2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. MAXIMUM RATINGS Symbol Parameter V DC Supply Voltage Input Voltage Output Voltage ...

Page 4

DC ELECTRICAL CHARACTERISTICS Symbol Characteristic V HIGH Level Input Voltage (Note LOW Level Input Voltage (Note HIGH Level Output Voltage OH V LOW Level Output Voltage OL I Input Leakage Current I I 3−State ...

Page 5

DYNAMIC SWITCHING CHARACTERISTICS Symbol Characteristic V Dynamic LOW Peak Voltage OLP (Note 4) V Dynamic LOW Valley Voltage OLV (Note 4) 4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output ...

Page 6

Vmi Dn t PHL Vmo On WAVEFORM 1 − PROPAGATION DELAYS 2.5 ns, 10 MHz Table 2. AC WAVEFORMS Symbol Vmi Vmo PULSE GENERATOR ...

Page 7

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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