HT36A3 Holtek Semiconductor Inc., HT36A3 Datasheet

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HT36A3

Manufacturer Part Number
HT36A3
Description
Ht36a3 -- 8-bit Music Synthesizer Mcu
Manufacturer
Holtek Semiconductor Inc.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HT36A3-000N
Manufacturer:
HOLTEK
Quantity:
16 076
Features
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General Description
The HT36A3 is an 8-bit high performance RISC-like
microcontroller specifically designed for music applica-
tions. It provides an 8-bit MCU and a 8 channel
wavetable synthesizer. The program ROM is composed
of both program control codes and wavetable voice
codes, and can be easily programmed.
Block Diagram
Rev. 1.00
Operating voltage: 2.4V~5.0V
Operating frequency: 3.58MHz~12MHz (typ. 8MHz)
20 bidirectional I/O lines
Two 8-bit programmable timer with 8 stage prescaler
Watchdog Timer
Built-in 8-bit MCU with 208´8 bits RAM
Built-in 32K´16-bit ROM for program/data shared
Mono output
High D/A converter resolution: 16 bits
Polyphonic up to 8 notes
Independent pan and volume mix can be assigned to
each sound component
8-Bit Music Synthesizer MCU
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The HT36A3 has a built-in 8-bit microprocessor which
programs the synthesizer to generate the melody by
setting the special register from 20H~2AH. A HALT fea-
ture is provided to reduce power consumption.
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Sampling rate of 25kHz as 6.4MHz for system
frequency
Eight-level subroutine nesting
HALT function and wake-up feature to reduce power
consumption
Bit manipulation instructions
16-bit table read instructions
63 powerful instructions
All instructions in 1 or 2 machine cycles
28-pin SOP, 48-pin SSOP package
HT36A3
June 30, 2003

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HT36A3 Summary of contents

Page 1

... Independent pan and volume mix can be assigned to each sound component General Description The HT36A3 is an 8-bit high performance RISC-like microcontroller specifically designed for music applica- tions. It provides an 8-bit MCU and a 8 channel wavetable synthesizer. The program ROM is composed of both program control codes and wavetable voice codes, and can be easily programmed ...

Page 2

... Pin Assignment Pad Assignment * The IC substrate should be connected to VSS in the PCB layout artwork. Rev. 1.00 2 Chip size: 83 111 (mil) 2 HT36A3 June 30, 2003 ...

Page 3

... Rev. 1.00 Y Pad No 693.900 17 583.300 18 483.300 19 372.700 805.050 20 272.700 21 162.100 931.910 22 62.100 23 48.500 24 148.500 25 259.100 26 359.100 27 469.700 28 471.774 569.700 29 680.300 Function 3 HT36A3 Y 1240.150 1240.150 1240.150 1240.150 1240.150 1240.150 1240.150 1240.150 1240.150 1240.150 1240.150 1240.150 1240.150 1240.150 June 30, 2003 ...

Page 4

... Input Low Voltage for I/O Ports IL Rev. 1.00 +6V Storage Temperature ........................... 125 C SS +0.3V Operating Temperature .......................... Test Conditions Min. V Conditions DD 2.2 4.5V No load, f =8MHz OSC 4.5V No load, System HALT 4.5V V =4. 4.5V V =0. 0.8V 4. HT36A3 Ta=25 C Typ. Max. Unit 4 June 30, 2003 ...

Page 5

... Application Circuit Rev. 1.00 5 June 30, 2003 HT36A3 ...

Page 6

... Package Information 28-pin SOP (300mil) Outline Dimensions Symbol Min. A 394 B 290 697 Rev. 1.00 Dimensions in mil Nom. Max. 419 300 20 713 104 June 30, 2003 HT36A3 ...

Page 7

... SSOP (300mil) Outline Dimensions Symbol Min. A 395 B 291 613 Rev. 1.00 Dimensions in mil Nom. Max. 420 299 12 637 June 30, 2003 HT36A3 ...

Page 8

... Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness SSOP 48W Symbol Description A Reel Outer Diameter B Reel Inner Diameter C Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness Rev. 1.00 Dimensions in mm 330 1.0 62 1.5 13.0+0.5 0.2 2.0 0.5 24.8+0.3 0.2 30.2 0.2 Dimensions in mm 330 1.0 100 0.1 13.0+0.5 0.2 2.0 0.5 32.2+0.3 0.2 38.2 0.2 8 June 30, 2003 HT36A3 ...

Page 9

... Description W Carrier Tape Width P Cavity Pitch E Perforation Position F Cavity to Perforation (Width Direction) D Perforation Diameter D1 Cavity Hole Diameter P0 Perforation Pitch P1 Cavity to Perforation (Length Direction) A0 Cavity Length B0 Cavity Width K0 Cavity Depth t Carrier Tape Thickness C Cover Tape Width Rev. 1.00 Dimensions in mm 24.0 0.3 12.0 0.1 1.75 0.1 11.5 0.1 1.5+0.1 1.5+0.25 4.0 0.1 2.0 0.1 10.85 0.1 18.34 0.1 2.97 0.1 0.35 0.01 21.3 9 June 30, 2003 HT36A3 ...

Page 10

... Carrier Tape Width P Cavity Pitch E Perforation Position F Cavity to Perforation (Width Direction) D Perforation Diameter D1 Cavity Hole Diameter P0 Perforation Pitch P1 Cavity to Perforation (Length Direction) A0 Cavity Length B0 Cavity Width K1 Cavity Depth K2 Cavity Depth t Carrier Tape Thickness C Cover Tape Width Rev. 1.00 Dimensions in mm 32.0 0.3 16.0 0.1 1.75 0.1 14.2 0.1 2.0 Min. 1.5+0.25 4.0 0.1 2.0 0.1 12.0 0.1 16.20 0.1 2.4 0.1 3.2 0.1 0.35 0.05 25.5 10 HT36A3 June 30, 2003 ...

Page 11

... Holtek s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.00 11 HT36A3 June 30, 2003 ...

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