CMZ12 TOSHIBA Semiconductor CORPORATION, CMZ12 Datasheet
CMZ12
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CMZ12 Summary of contents
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... Standard Soldering Pad 1.4 3.0 CMZ12~CMZ53 : (Ta = 25°C) Symbol Rating P 2.0 (Note 1) −40~150 T j −40~150 T stg Unit: mm 1.4 1 CMZ12~CMZ53 Unit W °C °C JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) 2006-11-09 Unit: mm ...
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... CMZ12~CMZ53 Forward Voltage Reverse Current V (V) I (μ Measure- ment Max Max Current Max I ( 1.2 0 1.2 0 1.2 0 1.2 0 1.2 0 1.2 ...
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... Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. 3) Please refer to the Rectifiers databook for further information. -tw. 3 CMZ12~CMZ53 of below 120°C. j 2006-11-09 ...
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... Soldering land: 2.0 mm × 2.0 mm 0.1 0.001 0.01 0 Time t (s) 1000 100 10 0.1 2 2.4 (typ.) 50 CMZ30~CMZ53 100 1000 4 CMZ12~CMZ53 P – t (reference value) RSM W P RSM 25°C Rectangular pulse Recommended 1 10 Pulse width t (ms) W α V (typ.) T – ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 CMZ12~CMZ53 20070701-EN 2006-11-09 ...