CUS02 TOSHIBA Semiconductor CORPORATION, CUS02 Datasheet
CUS02
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CUS02 Summary of contents
Page 1
... Junction to lead of cathode side th (j- JEDEC ― JEITA TOSHIBA 3-2B1A Weight: 0.004 g (typ.) Min Typ. Max ― 0.35 ― ― 0.42 0.45 ― 0.47 ― ― 0.7 ― ― 10 100 ― 40 ― ― ― 75 ― ― 150 ― ― 30 2006-11-13 CUS02 Unit: mm Unit V μA pF °C/W °C/W ...
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... Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. Unit: mm 0.8 0.5 0.8 has a temperature coefficient of 0.1%/°C. Take RRM curve. F(AV) of below 120° CUS02 2006-11-13 ...
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... Soldering land: 2.0 mm × 2.0 mm (2) Device mounted on a glass-epoxy board Soldering land: 6.0 mm × 6.0 mm 1000 (3) Device mounted on a glass-epoxy board Standard Soldering pad DC 100 10 1 1.4 1.6 0.001 0.01 (A) 3 CUS02 P – (AV) F (AV) DC 180° 120° Rectangular waveform 0° α 360° Conduction angle: α 0.4 ...
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... Rectangular waveform 0.7 0° α 360° 0.6 Conduction angle: α 150°C 0 0.4 0.3 0.2 0.1 0.0 140 160 0 4 CUS02 C – V (typ MHz Ta = 25°C 10 100 Reverse voltage V ( – V (typ.) R (AV 300° 240° 180° 120° ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 CUS02 20070701-EN 2006-11-13 ...