CMG02 TOSHIBA Semiconductor CORPORATION, CMG02 Datasheet - Page 3

• Manufacturer Part Number: CMG02
• Description: Toshiba Rectifier Silicon Diffused Type
• Manufacturer: TOSHIBA Semiconductor CORPORATION

0.01
100
160
140
120
100
100
0.1
10
80
60
40
20
90
80
70
60
50
40
30
20
10
1
0
0
0.2 0.4
0.0
1
Conduction angle 180°
Pulse test
Half-sine waveform
0.2
Instantaneous forward voltage v F
0°
Average forward current I
75°C
0.6
T j = 150°C
0.4
3
180°
0.8
0.6 0.8 1.0
Surge forward current
Tℓ max – I
Number of cycles
1.0
5
(non-repetitive)
25°C
1.2 1.4
i
F
– v
10
1.2
F
F (AV)
1.6 1.8 2.0
1.4
F (AV)
1.6 1.8
30
(A)
50
(V)
2.2 2.4
2.0
100
2.2
3
1000
160
140
120
100
100
0.1
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
10
80
60
40
20
0.001
1
0.0
0
0
Conduction angle 180°
board thickness: 1.6 mm
Device mounted on a glass-epoxy
board:
board size: 50 mm × 50 mm
Soldering land: 2.1 mm × 1.4 mm
Half-sine waveform
0.2
0.2
Device mounted on a ceramic board:
Soldering land: 2.0 mm × 2.0 mm
0°
0.01
Average forward current I
Average forward current I
0.4 0.6
Device mounted on a ceramic
board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 mm
0.4
180°
0.6 0.8 1.0
P
Ta max – I
0.1
0.8
F (AV)
1.0 1.2 1.4 1.6 1.8 2.0 2.2
Time t (s)
r
th (j-a)
– I
1
Device mounted on a glass-epoxy
board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 mm
1.2
F (AV)
Device mounted on a glass-epoxy board:
Soldering land: 6.0 mm × 6.0  m m
Device mounted on a glass-epoxy board:
Soldering land: 2.1 mm × 1.4 mm
F (AV)
– t
Conduction angle 180°
1.4
Half-sine waveform
10
F (AV)
F (AV)
1.6
0°
1.8 2.0
100
(A)
(A)
180°
2008-03-03
CMG02
1000
2.4
2.2