APTGS50X170TE3G Microsemi Corporation, APTGS50X170TE3G Datasheet - Page 3

• Manufacturer Part Number: APTGS50X170TE3G
• Description: 3 Phase Bridge Npt Igbt Power Module
• Manufacturer: Microsemi Corporation

Thermal and package characteristics
APT reserves the right to change, without notice, the specifications and information contained herein
Symbol Characteristic
Torque
Package outline
APT's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
V
R
T
Wt
T
T
ISOL
STG
thJC
C
J
Junction to Case
RMS Isolation Voltage, any terminal to case t =1 min,
I isol<1mA, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
APT website – http://www.advancedpower.com
ALL DIMENSIONS MARKED " * " ARE TOLERENCED AS :
To Heatsink
APTGS50X170TE3
Diode
IGBT
M5
PIN 1
PIN 21
2500
Min
-40
-40
-40
3
Typ
Max
0.26
0.56
150
125
125
300
4.5
Unit
°C/W
N.m
°C
V
g
3 - 3