MB87B301BPD-G-ER Fujitsu Microelectronics, Inc., MB87B301BPD-G-ER Datasheet
MB87B301BPD-G-ER
Related parts for MB87B301BPD-G-ER
MB87B301BPD-G-ER Summary of contents
Page 1
... MB87B301BPD-G-ER Glue 3 Logic Chip for Intel ® 810 and 820 Chipsets Glue 3 Logic Chip Description Glue third generation glue logic device for Intel boards using the Intel 810 chipset with Celeron™ processor or ® the Intel 820 chipset with Pentium III processors ...
Page 2
... MB87B301BPD-G-ER Pin Assignment Pin Signal Type 1 VREF3IN 3I 3.3V input 2 5VSB P (I) 5V system standby power supply 3 3VSB P (I) 3V system standby power supply 4 GPO_FLUSH_CACHE * 3I GPO from SIO/ICH 5 INIT * 3IU Signal from the ICH 6 PCIRST * 3I PCI reset signal 7 3V_DDCSCL 3IOD DDCSCL input/output 3.3V side 8 SLOTOCC*/CPU_PRE ...
Page 3
... V +1. -1. 5.0V ± 0.25V) DD5 Requirements Typical Maximum 3 3.3 3.6 4.75 5 5. DD3 x 0 DD5 2 DD5 0.2 ss DD3 0.3 ss DD5 Fujitsu Microelectronics, Inc. Unit ° Unit ° C ...
Page 4
... MB87B301BPD-G-ER PACKAGE 44-Pin Plastic QFJ (PLCC) LCC-44P-M02 Specifications Lead Pitch 1.27 mm Package Width x Package Length 16.59 ± 0.08 mm Package Height (including standoff) 4.30 + 0.22 - 0.11 mm Standoff Height 0.51 mm minimum Lead Shape J bend Sealing Method Plastic mold FUJITSU MICROELECTRONICS, INC. Corporate Headquarters 3545 North First Street, San Jose, California 95134-1804 Tel: (800) 866-8608 Fax: (408) 922-9179 E-mail: fmicrc@fmi ...