TEA7092 ST Microelectronics, Inc., TEA7092 Datasheet - Page 24

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TEA7092

Manufacturer Part Number
TEA7092
Description
Telephone Analog Front End
Manufacturer
ST Microelectronics, Inc.
Datasheet

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TEA7092
24/24
PACKAGE MECHANICAL DATA
44 PINS - PLASTIC QUAD FLAT PACK (THIN)
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
Dimensions
A1
A2
D1
D3
E1
E3
L1
C
D
A
B
E
K
e
L
Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco
I
2
C Patent. Rights to use these components in a I
Purchase of I
The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
Min.
0.05
1.35
0.30
0.09
0.45
2
34
44
C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
33
1
© 1996 SGS-THOMSON Microelectronics - All Rights Reserved
e
SGS-THOMSON Microelectronics GROUP OF COMPANIES
the I
Millimeters
D1
D3
2
D
12.00
10.00
12.00
10.00
C Standard Specifications as defined by Philips.
Typ.
1.40
0.35
8.00
0.80
8.00
0.60
1.00
11
23
12
22
2
C system, is granted provided that the system conforms to
Max.
1.60
0.15
1.45
0.40
0.20
0.75
0
o
(Min.), 7
o
(Max.)
0.002
0.053
0.012
0.004
0.018
Min.
K
Seating Plane
0.10mm
.004
A1
C
Inches
0.055
0.014
0.472
0.394
0.315
0.031
0.472
0.394
0.315
0.024
0.039
Typ.
A2
A
0.063
0.006
0.057
0.016
0.008
0.030
Max.

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