MT58L128L18F Micron Semiconductor Products, Inc., MT58L128L18F Datasheet

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MT58L128L18F

Manufacturer Part Number
MT58L128L18F
Description
2Mb Syncburst SRAM, 3.3V Vdd, 3.3V or 2.5V I/O, Flow-Through,
Manufacturer
Micron Semiconductor Products, Inc.
Datasheet

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NOT RECOMENDED FOR NEW DESIGNS
2Mb SYNCBURST
SRAM
FEATURES
• Fast clock and OE# access times
• Single +3.3V +0.3V/-0.165V power supply (V
• Separate +3.3V or +2.5V isolated output buffer
• SNOOZE MODE for reduced-power standby
• Common data inputs and data outputs
• Individual BYTE WRITE control and GLOBAL
• Three chip enables for simple depth expansion and
• Clock-controlled and registered addresses, data
• Internally self-timed WRITE cycle
• Burst control pin (interleaved or linear burst)
• Automatic power-down
• 100-pin TQFP package
• Low capacitive bus loading
• x18, x32, and x36 versions available
OPTIONS
• Timing (Access/Cycle/MHz)
• Configurations
• Packages
• Operating Temperature Range
2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM
MT58L128L18F_C.p65 – Rev. C, Pub. 11/02
supply (V
WRITE
address pipelining
I/Os and control signals
6.8ns/8.0ns/125 MHz
7.5ns/8.8ns/113 MHz
8.5ns/10ns/100 MHz
10ns/15ns/66 MHz
3.3V I/O
2.5V I/O
100-pin TQFP
Commercial (0°C to +70°C)
128K x 18
128K x 18
64K x 32
64K x 36
64K x 32
64K x 36
DD
Q)
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.
MT58L64L36FT-8.5
Part Number Example:
MT58L128V18F
MT58L128L18F
MT58L64V32F
MT58L64V36F
MT58L64L32F
MT58L64L36F
MARKING
None
-6.8
-7.5
-8.5
-10
T
DD
)
FLOW-THROUGH SYNCBURST SRAM
1
MT58L128L18F, MT58L64L32F,
MT58L64L36F; MT58L128V18F,
MT58L64V32F, MT58L64V36F
3.3V V
GENERAL DESCRIPTION
high-speed, low-power CMOS designs that are fabri-
cated using an advanced CMOS process.
18, 64K x 32, or 64K x 36 SRAM core with advanced
synchronous peripheral circuitry and a 2-bit burst
counter. All synchronous inputs pass through registers
controlled by a positive-edge-triggered single clock
input (CLK). The synchronous inputs include all ad-
dresses, all data inputs, active LOW chip enable (CE#),
two additional chip enables for easy depth expansion
(CE2, CE2#), burst control inputs (ADSC#, ADSP#,
ADV#), byte write enables (BWx#) and global write
(GW#).
(OE#), snooze enable (ZZ) and clock (CLK). There is also
a burst mode pin (MODE) that selects between inter-
leaved and linear burst modes. The data-out (Q), en-
abled by OE#, is also asynchronous. WRITE cycles can
be from one to two bytes wide (x18) or from one to four
bytes wide (x32/x36), as controlled by the write control
inputs.
status processor (ADSP#) or address status controller
(ADSC#) input pins. Subsequent burst addresses can be
internally generated as controlled by the burst advance
pin (ADV#).
*JEDEC-standard MS-026 BHA (LQFP).
The Micron
Micron’s 2Mb SyncBurst SRAMs integrate a 128K x
Asynchronous inputs include the output enable
Burst operation can be initiated with either address
2Mb: 128K x 18, 64K x 32/36
DD
, 3.3V or 2.5V I/O, Flow-Through
®
100-Pin TQFP*
SyncBurst
SRAM family employs
©2002, Micron Technology, Inc.

Related parts for MT58L128L18F

MT58L128L18F Summary of contents

Page 1

... Operating Temperature Range Commercial (0°C to +70°C) Part Number Example: MT58L64L36FT-8.5 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE. 2Mb: 128K x 18, 64K x 32/36 FLOW-THROUGH SYNCBURST SRAM ™ ...

Page 2

... CE2 CE2# OE# NOTE: Functional Block Diagrams illustrate simplified device operation. See truth table, pin descriptions and timing diagrams for detailed information. 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM FUNCTIONAL BLOCK DIAGRAM 128K ...

Page 3

... Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version. 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 2Mb: 128K x 18, 64K x 32/36 FLOW-THROUGH SYNCBURST SRAM Micron’s 2Mb SyncBurst SRAMs operate from a +3 ...

Page 4

... Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version. 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM PIN ASSIGNMENT (Top View) 100-Pin TQFP ...

Page 5

... ADV ADSP# 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM TYPE SA0 Input Synchronous Address Inputs: These inputs are registered and must SA1 meet the setup and hold times around the rising edge of CLK. ...

Page 6

... NC/SA 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM TYPE Input Synchronous Address Status Controller: This active LOW input interrupts any ongoing burst, causing a new external address to be registered. A READ or WRITE is performed using the new address if CE# is LOW ...

Page 7

... WRITE All Bytes WRITE All Bytes NOTE: Using BWE# and BWa# through BWd#, any one or more bytes may be written. 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 2Mb: 128K x 18, 64K x 32/36 FLOW-THROUGH SYNCBURST SRAM THIRD ADDRESS (INTERNAL) X...X01 X ...

Page 8

... ADSP# LOW always initiates an internal READ at the L-H edge of CLK. A WRITE is performed by setting one or more byte write enable signals and BWE# LOW or GW# LOW for the subsequent L-H edge of CLK. Refer to WRITE timing diagram for clarification. 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM ADSP# ADSC# ADV# WRITE# OE# USED ...

Page 9

... V Q should never exceed V DD 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM *Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional ...

Page 10

... Typical values are measured at 3.3V, 25°C, and 15ns cycle time. 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM = +3.3V +0.3V/-0.165V unless otherwise noted) CONDITIONS SYM or ≥ ...

Page 11

... DESCRIPTION Thermal Resistance Test conditions follow standard test methods (Junction to Ambient) Thermal Resistance (Junction to Top of Case) NOTE: 1. This parameter is sampled. 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM CONDITIONS SYMBOL T = 25° MHz 3.3V ...

Page 12

... Chip enable must be valid at each rising edge of CLK when either ADSP# or ADSC# is LOW to remain enabled. 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM -6.8 ...

Page 13

... The Micron 128K x 18, 64K x 32, and 64K x 36 SyncBurst SRAM timing is dependent upon the capaci- tive loading on the outputs. Consult the factory for copies of I/O current versus voltage curves. 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM 2.5V I/O AC TEST CONDITIONS = (V /2.2) + 1.5V Input pulse levels ............. V ...

Page 14

... I ISB2Z ALL INPUTS (except ZZ) Outputs (Q) 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 2Mb: 128K x 18, 64K x 32/36 FLOW-THROUGH SYNCBURST SRAM The ZZ pin is an asynchronous, active HIGH input that causes the device to enter SNOOZE MODE. When the ZZ pin becomes a logic HIGH, I ...

Page 15

... CE# is HIGH, CE2# is HIGH and CE2 is LOW. 3. Timing is shown assuming that the device was not enabled before entering into this sequence. 4. Outputs are disabled t KQHZ after deselect. 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM READ TIMING t ADSS t ADSH A2 ...

Page 16

... Full-width WRITE can be initiated by GW# LOW; or GW# HIGH and BWE#, BWa# and BWb# LOW for the x18 version; or GW# HIGH and BWE#, BWa#-BWd# LOW for the x32 and x36 versions. 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM WRITE TIMING ...

Page 17

... The data bus (Q) remains in High-Z following a WRITE cycle unless an ADSP#, ADSC# or ADV# cycle is performed. 4. GW# is HIGH. 5. Back-to-back READs may be controlled by either ADSP# or ADSC#. 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM READ/WRITE TIMING A3 A4 ...

Page 18

... E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992 Micron, SyncBurst, the M logo, and the Micron logo are trademarks and/or service marks of Micron Technology, Inc. 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 FLOW-THROUGH SYNCBURST SRAM 100-PIN PLASTIC TQFP (JEDEC LQFP) 0.625 14.00 ± ...

Page 19

... Changed heading on Mechanical Drawing from BGA to FBGA Added 165-Pin FBGA package, REV 3/00, FINAL ....................................................................................... May/23/00 Added PRELIMINARY PACKAGE DATA to diagram 2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM MT58L128L18F_C.p65 – Rev. C, Pub. 11/02 2Mb: 128K x 18, 64K x 32/36 FLOW-THROUGH SYNCBURST SRAM 19 Micron Technology, Inc., reserves the right to change products or specifications without notice. ...

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