TS68040 ATMEL Corporation, TS68040 Datasheet

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TS68040

Manufacturer Part Number
TS68040
Description
32-bit Mpu, 25-33 MHZ
Manufacturer
ATMEL Corporation
Datasheet

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February 1998
DESCRIPTION
The TS 68040 is Thomson’s third generation of 68000-com-
patible, high-performance, 32-bit microprocessors. The
TS 68040 is a virtual memory microprocessor employing mul-
tiple, concurrent execution units and a highly integrated archi-
tecture to provide very high performance in a monolithic
HCMOS device. On a single chip, the TS 68040 integrates an
68030-compatible integer unit, an IEEE 754-compatible floa-
ting-point unit (FPU), and fully independent instruction and
data demand-paged memory management units (MMUs), in-
cluding independent 4K-byte instruction and data caches. A
high degree of instruction execution parallelism is achieved
through the use of multiple independent execution pipelines,
multiple internal buses, and a full internal Harvard architec-
ture, including separate physical caches for both instruction
and data accesses. The TS 68040 also directly supports ca-
che coherency in multimaster applications with dedicated on-
chip bus snooping logic.
The TS 68040 is user-object-code compatible with previous
members of the TS 68000 Family and is specifically opti-
mized to reduce the execution time of compiler-generated
code. The 68040 HCMOS technology, provides an ideal ba-
lance between speed, power, and physical device size.
Figure 1 is a simplified block diagram of the TS 68040. Ins-
truction execution is pipelined in both the integer unit and FPU.
Independent data and instruction MMUs control the main ca-
ches and the address translation caches (ATCs). The ATCs
speed up logical-to-physical address translations by storing re-
cently used translations. The bus snooper circuit ensures cache
coherency in multimaster and multiprocessing applications.
MAIN FEATURES
SCREENING
26-42 MIPS integer performance.
3.5-5.6 MFLOPS floating-point-performance.
IEEE 754-Compatible FPU.
Independant instruction and data MMUs.
4K-byte physical instruction cache and 4K-byte physical
data cache accessed simultaneously.
32-bit, nonmultiplexed external address and data buses
with synchronous interface.
User-object-code compatibility with all earlier TS 68000
microprocessors.
Multimaster / multiprocessor support via bus snooping.
Concurrent integer unit, FPU, MMU, bus controller, and
bus snooper maximize throughput.
4-Gbyte direct addressing range.
Software support including optimizing C compiler and
unix* system V port.
IEEE P 1149-1 test mode (J tag).
f = 25 MHz, 33 MHz ; V CC = 5 V
The use of the TS 88915T clock driver is suggested.
MIL-STD-883.
DESC. Drawing 5962-93143.
TCS standards.
5 % ; P D = 7 W.
This document contains information on a new product. Specifica-
tions and information herein are subject to change without notice.
32-BIT MICROPROCESSOR
Gullwing shape lead Ceramic Quad Flat Pack
THIRD-GENERATION
Ceramic Pin Grid Array
Cavity down
CQFP 196
PGA 179
R suffix
F suffix
TS 68040
1/38

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TS68040 Summary of contents

Page 1

DESCRIPTION The TS 68040 is Thomson’s third generation of 68000-com- patible, high-performance, 32-bit microprocessors. The TS 68040 is a virtual memory microprocessor employing mul- tiple, concurrent execution units and a highly integrated archi- tecture to provide very high performance in ...

Page 2

SUMMARY A - GENERAL DESCRIPTION 1 - INTRODUCTION 2 - PIN ASSIGNMENTS 2.1 - PGA 179 2.2 - CQFP 196 3 - SIGNAL DESCRIPTION 2/ DETAILED SPECIFICATIONS 1 - SCOPE 2 - APPLICABLE DOCUMENTS 3 - REQUIREMENTS 3.1 ...

Page 3

A - GENERAL DESCRIPTION 1 - INTRODUCTION The TS 68040 is an enhanced, 32-bit, HCMOS microprocessor that combines the integer unit processing capabilities of the TS 68030 microprocessor with independent 4K-byte data and instruction caches and an on-chip FPU. The ...

Page 4

PIN ASSIGNMENTS 2.1 - PGA 179 Table 1 PLL Internal logic Output drivers 4/38 Figure 2 : Bottom view. GND C6, C7, C9, C11, C13, K3, K16, L3, M16, R4, R11, R13, S10, T4, S9, R6, R10 B2, ...

Page 5

CQFP 196 Table 2 PLL Internal logic Output drivers Figure 3 : Pin assignments. GND 4, 9, 10, 19, 32, 45, 73, 88, 113, 119, 121, 122, 124, 125, 129, 130, 141, 159, 172 7, 15, 22, 28, ...

Page 6

SIGNAL DESCRIPTION Figure 4 and Table 3 describe the signals on the TS 68040 and indicate signal functions. The test signals, TRST, TMS, TCK, TDI, and TDO, comply with subset P-1149.1 of the IEEE testability bus standard. 6/38 ...

Page 7

Table 3 - Signal index Signal Name Address bus Data bus Transfer type Transfer modifier Transfer line number User programmable attributes Read write Transfer size Bus lock Bus lock end Cache inhibit out Transfer start Transfer in progress Transfer acknowledge ...

Page 8

Table 3 - Signal index (Continued) Signal Name Processor clock Test clock Test mode select Test data input Test data output Test reset Power supply Ground B - DETAILED SPECIFICATIONS 1 - SCOPE This drawing describes the specific requirements for ...

Page 9

Table 4 - Absolute maximum ratings Symbol V CC Supply voltage range V I Input voltage range P D Power dissipation T C Operating temperature T stg Storage temperature range T J Junction temperature (see Note) T lead Lead temperature ...

Page 10

Thermal device characteristics The TS 68040 presents some inherent characteristics which should be considered when evaluating a method of cooling the device. The following paragraphs discuss these die / package and power considerations. Die and package The TS 68040 is ...

Page 11

Relationships between thermal resistances and temperatures Since the maximum operating junction temperature has been specified to be 125°C. The maximum case temperature °C can be obtained from : where : Maximum case temperature ...

Page 12

Table 8 - Thermal parameters with forced air flow and no heat sink Thermal Mgmt. Defined parameters Technique P D Air-flow velocity 100 LFM 3 W 250 LFM 3 W 500 LFM 3 W 750 LFM 000 ...

Page 13

All pin fin heat sinks tested were made from extrusion Al products. The planar face of the heat sink mating to the package should have a good degree of planarity ; if it has any curvature, the curvature should be ...

Page 14

Table 10 - Thermal parameters with heat sink and air-flow Thermal Mgmt. Technique P D Air-flow Heat sink 100 LFM 2338B 3 W 250 LFM 2338B 3 W 500 LFM 2338B 3 W 750 LFM 2338B 000 ...

Page 15

Mechanical and environment The microcircuits shall meet all mechanical environmental requirements of either MIL-STD-883 for class B devices or for TCS standard screening. 3.6 - Marking The document where are defined the marking are identified in the related ...

Page 16

Table 12 - Electrical characteristics (Continued) Symbol V OL Output low voltage Larger buffers - I Small buffers - Power dissipation (T Larger buffers enabled Small buffers enabled Capacitance - Note ...

Page 17

Table 14 - Output AC timing specifications (Note 1) (Figures 9 - 15) These output specifications are for only 25 MHz they must be scaled for lower operating frequencies. Refer to TS 6804DH/AD for further information. – 55° ...

Page 18

Table 14 - Output AC timing specifications (Continued) Num Characteristic 43 BCLK to MI valid 48 BCLK to TA valid 50 BCLK to IPEND, PSTn, RSTO valid Note 1 : Output timing is specified for a valid signal measured at ...

Page 19

Table 15 - Input AC timing specifications (Figures 9 - 15) – 55° 4. Jmax Num 15 Data-in valid to BCLK (setup) 16 BCLK to data-in invalid (hold) 17 BCLK to data-in high ...

Page 20

Note : Transfer attribute signals UPAN, SIZN, TTN, TMN, TLNN, R/W, LOCK, LOCKE, CIOUT Table 16 - JTAG timing application (Figures 16 - 19) – 55° 4. Jmax Num TCK frequency 1 TCK ...

Page 21

Table 17 - Boundry scan instruction codes Bit 2 Bit 5.4 - Switching test circuit and waveforms Figure 10 : Address and data ...

Page 22

Figure 12 : Bus arbitation timing. Figure 13 : Snoop hit timing. ...

Page 23

Figure 14 : Snoop miss timing. Figure 15 : Other signal timing. 23/38 ...

Page 24

Figure 16 : Clock input timing diagram. Figure 17 : TRST timing diagram. Figure 18 : Boundry scan timing diagram. Figure 19 : Test access port timing diagram. ...

Page 25

FUNCTIONAL DESCRIPTION 6.1 - Programming model The TS 68040 integrates the functions of the integer unit, MMU, and FPU. As shown in Figure 20, the registers depicted in the programming model provide access and control for the three ...

Page 26

Data types and addressing modes The TS 68040 supports the basic data types shown in Table 18. Some data types apply only to the integer unit, some only to the FPU, and some to both the integer unit ...

Page 27

Single- and double-precision floating-point data formats are implemented in the FPU as defined by the IEEE standard. These data formats are the main floating-point formats and should be used for most calculations involving real numbers. The extended-precision data format is ...

Page 28

Instruction set overview The instruction provided by the TS 68040 are listed in Table 20. The instruction set has been tailored to support high-level languages and is optimized for those instructions most commonly executed (however, all instructions listed ...

Page 29

Table 21 - Floating-point instructions Mnemonic Description *FABS Floating-point absolute value *FADD Floating-point add *FBcc Branch on floating-point condition *FCMP Floating-point compare *FDBcc Floating-point decrement and branch *FDIV Floating-point divide *FMOVE Move floating-point register *FMOVEM Move multiple floating-point registers Floating-point ...

Page 30

The caches are accessed by physical addresses from the on-chip MMUs. The translation of the upper bits of the logical address occurs concurrently with the accesses into the set array in the cache by the lower address bits. The output ...

Page 31

Cache instructions The TS 68040 supports the following instructions for cache maintenance. Both instructions may selectively operate on the data or instruction cache. CINV : Invalidates a single line, all lines in a physical page, or the entire ...

Page 32

Translation mechanism Because logical-to-physical address translation is one of the most frequently executed operations of the TS 68040 MMUs, this task has been optimized. Each MMU initiates address translation by searching for a descriptor containing the address translation ...

Page 33

Transparent translation Four transparent translation registers, two each for instruction and data accesses, have been provided on the TS 68040 MMU to allow portions of the logical address space to be transparently mapped and accessed without the need ...

Page 34

Tie bar CQFP cavity up (on request) 34/38 Dim Millimeters Inches A 3.30 max 0.130 max 0.05 .002 B 0.23 .009 – – 0.038 .015 C 0.635 typ. .025 typ. 33.91 0.25 1.335 .01 D1 ...

Page 35

Gullwing CQFP cavity up * Reduced pin count shown for clarity, 49 pins per side Symbol Millimeters Inches A 4.19 max 0.165 max 0.673 0.2 .0265 .008 A1 0.05 b 0.23 .009 – – 0.038 ...

Page 36

ORDERING INFORMATION 10.1 - MIL-STD-883 C and internal standard Note 1 : THOMSON-CSF SEMICONDUCTEURS SPECIFIQUES. Note request. Note 3 : Standard process. Note request for small quantity. 10.2 - DESC ...

Page 37

... DESC TS68040DESC02ZA DESC TS68040DESC02ZC DESC TS68040MFB/C25 MIL-STD-883 TS68040MFB/C33 MIL-STD-883 TS68040MRD/T25 BURN IN TS68040MRD/T33 BURN IN TS68040MFD/T25 BURN IN TS68040MFD/T33 BURN IN Note : THOMSON-CSF SEMICONDUCTEURS SPECIFIQUES. 10.3.2 - Standard product Commercial TCS part number Norms (see Note) TS68040VR25 TCS standard TS68040VR33 TCS standard TS68040MR25 TCS standard TS68040MR33 TCS standard ...

Page 38

TS 68040 Information furnished is believed to be accurate and reliable. However THOMSON-CSF SEMICONDUCTEURS SPECIFIQUES assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may ...

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