MD2200 ETC, MD2200 Datasheet - Page 13

• Manufacturer Part Number: MD2200
• Description: Disk Onchip 2000 DIP
• Manufacturer: ETC

7
7.1 Absolute Maximum Ratings
Note 1: Permanent device damage may occur if absolute maximum ratings are exceeded. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Note 2: The voltage on any pin may undershoot to -2.0V or overshoot to Vcc+2.0V for periods <20ns.
7.2 Capacitance
Note: Capacitance is not 100% tested.
7.3 Temperature Ranges
Commercial operating temperature:
Extended operating temperature:
Storage temperature:
*DiskOnChip 2000 192MB and 576MB capacities are available only for commercial temperature ranges.
7.4 DiskOnChip Assembly
The DiskOnChip 2000 DIP device is not hermetically sealed. Therefore, it must be assembled after
the PCB goes through its final rinse. Assembling DiskOnChip 2000 prior to the rinse phase may
cause it to absorb moisture. Failure to adhere to the above assembly instruction can lead to device
failures not covered by M-Systems' warranty.
Note: DiskOnChip 2000 DIP requires a DIP socket on the target platform. Due to its plastic shell and molding material, it
cannot be soldered directly to the platform.
7.5 Humidity
10% - 90% relative, non-condensing
91-SR-002-42-8L Rev. 3.4
Parameter
DC supply
voltage
Input pin
voltage
Input pin
current
Symbol
C
I/O
Specifications
2
Input/Output
Capacitance
Parameter
Symbol
V
V
I
CCS
IN
IN
MD2200/2, V
MD2203, V
Conditions
3.3V Model Rating
-0.5 to V
Not Specified
-0.5 to 4.6
IN
IN
= 0V
CC
= 0V
+ 0.3
-40 ºC to +85 ºC
-50 ºC to +85 ºC
0 ºC to +70 ºC*
3.3V Model Rating
1
5V Model Rating
-0.3 to V
12
36
-0.3 to 6.0
-10 to 10
CC
+ 0.3
5V Model Rating
1
Units
mA
15
45
V
V
DiskOnChip 2000 DIP
+25 °C
Notes
Unit
pF
pF
13