MC74ACT125DR2G ON Semiconductor, MC74ACT125DR2G Datasheet - Page 5

• Manufacturer Part Number: MC74ACT125DR2G
• Description: IC BUFF TRI-ST QD N-INV 14SOIC
• Manufacturer: ON Semiconductor
• Series: 74ACTr

Specifications of MC74ACT125DR2G

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 4
• Number Of Bits Per Element: 1
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Logic Family: 74ACT
• Number Of Channels Per Chip: Quad
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Maximum Operating Temperature: 85 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 24 mA
• Input Bias Current (max): 8 uA
• Low Level Output Current: 24 mA
• Maximum Power Dissipation: 500 mW
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 3
• Output Type: 3-State
• Propagation Delay Time: 9 ns @ 5 V
• Logical Function: Buffer/Line Driver
• Number Of Elements: 4
• Number Of Channels: 4
• Number Of Inputs: 4
• Number Of Outputs: 4
• Operating Supply Voltage (typ): 5V
• Package Type: SOIC
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• Quiescent Current: 8uA
• Technology: CMOS
• Pin Count: 14
• Mounting: Surface Mount
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC74ACT125DR2GOS; MC74ACT125DR2GOS; MC74ACT125DR2GOSTR

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
*This package is inherently Pb−Free.
ORDERING INFORMATION
Specifications Brochure, BRD8011/D.
MC74AC125N
MC74AC125NG
MC74AC125D
MC74AC125DG
MC74AC125DR2
MC74AC125DR2G
MC74AC125DTR2
MC74AC125DTR2G
MC74AC125M
MC74AC125MG
MC74AC125MEL
MC74AC125MELG
MC74ACT125DR2
MC74ACT125DR2G
MC74ACT125DTR2
MC74ACT125DTR2G
MC74ACT125MEL
MC74ACT125MELG
MC74ACT125N
MC74ACT125NG
14
1
MC74AC125N
AWLYYWWG
PDIP−14
Device
14
14
1
1
(Note: Microdot may be in either location)
AWLYWW
AWLYWW
ACT125G
AC125G
SOIC−14
A
L, WL
Y, YY
W, WW
G or G
MARKING DIAGRAMS
http://onsemi.com
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
TSSOP−14*
TSSOP−14*
TSSOP−14*
TSSOP−14*
SOEIAJ−14
SOEIAJ−14
SOEIAJ−14
SOEIAJ−14
SOEIAJ−14
SOEIAJ−14
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
Package
PDIP−14
PDIP−14
SOIC−14
SOIC−14
SOIC−14
SOIC−14
SOIC−14
SOIC−14
PDIP−14
PDIP−14
5
14
14
1
1
TSSOP−14
ALYWG
ALYWG
ACT
125
125
AC
G
G
2500 / Tape & Reel
2000 / Tape & Reel
2500 / Tape & Reel
2000 / Tape & Reel
25 Units / Rail
55 Units / Rail
50 Units / Rail
25 Units / Rail
14
14
Shipping
1
1
SOEIAJ−14
74ACT125
74AC125
ALYWG
ALYWG
†