STD1NB80 ST Microelectronics, STD1NB80 Datasheet

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STD1NB80

Manufacturer Part Number
STD1NB80
Description
N-CHANNEL POWER MOSFET
Manufacturer
ST Microelectronics
Datasheet

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STD1NB80
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STD1NB80-1 PB
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STD1NB80-1,D1NB80
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DESCRIPTION
Using the latest high voltage MESH OVERLAY
process, STMicroelectronics has designed an
advanced family of power MOSFETs with
outstanding performances. The new patent
pending strip layout coupled with the Company’s
proprietary edge termination structure, gives the
lowest R
and dv/dt capabilities and unrivalled gate charge
and switching characteristics.
APPLICATIONS
ABSOLUTE MAXIMUM RATINGS
( ) Pulse width limited by safe operating area
May 1999
STD1NB80
Symbol
dv/dt(
TYPICAL R
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
VERY LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
ADD SUFFIX "T4" FOR ORDERING IN
TAPE&REEL
SWITCH MODE POWER SUPPLIES (SMPS)
AC ADAPTORS AND BATTERY CHARGERS
FOR HANDHELD EQUIPMENT
I
V
DM
V
V
P
T
DGR
I
I
T
stg
DS
GS
D
D
tot
TYPE
( )
j
1
)
DS(on)
Drain-source Voltage (V
Drain- gate Voltage (R
Gate-source Voltage
Drain Current (continuous) at T
Drain Current (continuous) at T
Drain Current (pulsed)
Total Dissipation at T
Derating Factor
Peak Diode Recovery voltage slope
Storage Temperature
Max. Operating Junction Temperature
DS(on)
per area, exceptional avalanche
800 V
V
= 16
DSS
N - CHANNEL 800V - 16 - 1A - DPAK/IPAK
R
< 20
DS(on)
c
Parameter
GS
= 25
GS
= 20 k )
= 0)
o
C
c
c
1 A
= 25
= 100
I
D
o
C
o
C
(
1
) I
SD
PowerMESH
INTERNAL SCHEMATIC DIAGRAM
(Suffix "-1")
di/dt 200 A/ s, V
TO-251
IPAK
-65 to 150
1
Value
DD
0.63
800
800
150
0.4
4.5
2
50
1
4
30
3
V
STD1NB80
(BR)DSS
PRELIMINARY DATA
, Tj
MOSFET
(Suffix "T4")
TO-252
DPAK
T
JMAX
1
3
W/
V/ns
Unit
o
o
W
V
V
V
A
A
A
C
C
o
C
1/6

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STD1NB80 Summary of contents

Page 1

... DS(on INTERNAL SCHEMATIC DIAGRAM Parameter = 100 STD1NB80 MOSFET PRELIMINARY DATA IPAK DPAK TO-251 TO-252 (Suffix "-1") (Suffix "T4") Value 800 800 0.4 4.5 -65 to 150 150 di/dt 200 ...

Page 2

... STD1NB80 THERMAL DATA R Thermal Resistance Junction-case thj-case Thermal Resistance Junction-ambient Rthj-amb Thermal Resistance Case-Sink Rthc-sink T Maximum Lead Temperature For Soldering Purpose l AVALANCHE CHARACTERISTICS Symbol I Avalanche Current, Repetitive or Not-Repetitive AR (pulse width limited Single Pulse Avalanche Energy AS o (starting ELECTRICAL CHARACTERISTICS (T ...

Page 3

... Test Conditions V = 640 1 4 Test Conditions 1.1 A di/dt = 100 100 150 STD1NB80 Min. Typ. Max. Unit Min. Typ. Max. Unit Min. ...

Page 4

... STD1NB80 TO-251 (IPAK) MECHANICAL DATA DIM. MIN. A 2.2 A1 0.9 A3 0.7 B 0. 0. 6.4 G 4 4/6 mm TYP. MAX. MIN. 2.4 0.086 1.1 0.035 1.3 0.027 0.9 0.025 5.4 0.204 0.85 0.3 0.95 0.6 0.017 0.6 0.019 6.2 0.236 6.6 0.252 4.6 0.173 16.3 0.626 9.4 0.354 1.2 0.031 0 inch TYP. MAX. 0.094 0.043 0.051 ...

Page 5

... H 9.35 L2 0.8 L4 0.6 H DETAIL "A" MAX. MIN. 2.4 0.086 1.1 0.035 0.23 0.001 0.9 0.025 5.4 0.204 0.6 0.017 0.6 0.019 6.2 0.236 6.6 0.252 4.6 0.173 10.1 0.368 1 0.023 L4 STD1NB80 inch TYP. MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.260 0.181 0.397 0.031 0.039 DETAIL "A" 0068772-B 5/6 ...

Page 6

... STD1NB80 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice ...

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