RS2051 Orister Corporation, RS2051 Datasheet - Page 11

• Manufacturer Part Number: RS2051
• Description: Green?mode
• Manufacturer: Orister Corporation

Soldering Methods for Orister’s Products
1. Storage environment: Temperature=10
2. Reflow soldering of surface‐mount devices
3. Flow (wave) soldering (solder dipping)
Figure 1: Temperature profile
Average ramp‐up rate (T
Preheat
‐ Temperature Min (Ts
‐ Temperature Max (Ts
‐ Time (min to max) (ts)
Tsmax to T
‐ Ramp‐up Rate
Time maintained above:
‐ Temperature (T
‐ Time (t
Peak Temperature (T
Time within 5
Temperature (t
Ramp‐down Rate
Time 25
Pb devices.
Pb‐Free devices.
DS‐RS2051‐09 November, 2009
o
L
C to Peak Temperature
)
L
Profile Feature
o
C of actual Peak
Products
P
)
L
25
)
T
T
P
L
P
)
min
max
Ts
Ts
L
)
to T
)
min
max
P
)
o
Preheat
C~35
t 25
t
S
o
o
C Humidity=65%±15%
C to Peak
Sn‐Pb Eutectic Assembly
Peak temperature
Time
240
260
Ramp-up
60~120 sec
60~150 sec
<6 minutes
245
10~30 sec
<3
<3
<6
o
o
100
150
183
C +0/‐5
C +0/‐5
o
o
o
o
C/sec
C/sec
C/sec
C ± 5
o
o
o
C
C
C
o
C
o
o
C
C
Ramp-down
t
P
t
L
Critical Zone
Pb‐Free Assembly
T
260
L
Dipping time
60~180 sec
60~150 sec
<8 minutes
to T
5sec ± 1sec
5sec ± 1sec
20~40 sec
<3
<3
<6
o
150
200
217
C +0/‐5
o
o
o
P
C/sec
C/sec
C/sec
o
o
o
C
C
C
www.Orister.com
o
C
Page No. : 11/12