CRF03 Toshiba Semiconductor, CRF03 Datasheet
CRF03
Available stocks
Related parts for CRF03
CRF03 Summary of contents
Page 1
... F (AV) = 2.0 V (max 100 ns (max ” (Toshiba package name) (Ta = 25°C) Symbol Rating V 600 RRM I 0.7 F(AV) (Note (50 Hz) FSM −40~150 T j −40~150 T stg 1 CRF03 Unit JEDEC ― °C JEITA ― °C TOSHIBA 3-2A1A Weight: 0.013 g (typ.) 2006-11-07 Unit: mm ...
Page 2
... Device mounted on a glass-epoxy board (board size × 50 mm) (soldering land: 1.2 mm × 1.2 mm) (board thickness: 1 (j-ℓ) Standard Soldering Pad Part No. CRF03 1.2 2 CRF03 Min Typ. Max ⎯ 2.0 1.5 ⎯ ⎯ 50 ⎯ ⎯ 100 ⎯ ...
Page 3
... Device mounted on a glass-epoxy board (board size × 50 mm, land size × 6 mm, 10 board thickness: 1.6 t) Device mounted on a ceramic board (board size × 50 mm, land size × 2 mm, board thickness: 0. 0.001 0.01 0 100 Time t (ms) 2006-11-07 CRF03 1.0 1.0 1000 ...
Page 4
... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 4 CRF03 20070701-EN 2006-11-07 ...