D7225G NEC, D7225G Datasheet - Page 47

• Manufacturer Part Number: D7225G
• Description: Search -----> UPD7225G
• Manufacturer: NEC

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12. RECOMMENDED SOLDERING CONDITIONS
conditions.
Surface Mount Type
Caution
Partial Heating
Infrared reflow
VPS
Wave soldering
Soldering Method
Soldering Method
When mounting the PD7225 by soldering, soldering should be performed under the following recommended
Should other than recommended conditions be used, consult with our sales personnel.
Reference Documents
PD7225G00
PD7225G01
PD7225GC-AB6 : 52-pin plastic QFP (14
PD7225GB-3B7
NEC Semiconductor Device Reliability / Quality Control System (C10983E)
Quality Grades to NEC’s Semiconductor Devices (C11531E)
Semiconductor Device Mounting Technology Manual (C10535E)
Do not use two or more soldering methods in combination (except the partial heating method).
Pin temperature: 300 C MAX., Time: 3 seconds MAX. (Per side of device)
Package peak temperature: 235 C, Time: 30 seconds MAX. (210 C MIN.),
Number of times: 3 MAX.
Package peak temperature: 215 C, Time: 40 seconds MAX. (200 C MIN),
Number of times: 3 MAX.
Solder bath temperature: 260 C MAX., Time: 10 seconds MAX., Number of
times: 1, Preheating temperature: 120 C MAX. (Package surface)
: 52-pin plastic QFP (14
: 52-pin plastic QFP (straight) (
: 56-pin plastic QFP (10
Data Sheet S14308EJ6V0DS00
Soldering Condition
Soldering Condition
14 mm)
14 mm)
10 mm)
14 mm)
Soldering Condition
Soldering Condition
Recommended
Recommended
IR35-00-3
VP-15-00-3
WS-60-00-1
Symbol of
Symbol of
PD7225
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