TC1301 Transcom, TC1301 Datasheet - Page 6

• Manufacturer Part Number: TC1301
• Description: Low Noise and Medium Power GaAs FETs
• Manufacturer: Transcom

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TC1301
LARGE SIGNAL MODEL, V
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290 C
Tweezers; Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220 C to 250 C; Bond Tip Temperature: 150 C; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at
all stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC., 90 Dasoong 7
Web-Site: www.transcominc.com.tw
SCHEMATIC
Lg
Cgs
Ris
Rg
Cgd
Rid
Id
Rs
Ls
Cds
th
Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
DS
= 6 V, I
Cbs
Rdb
Rd
DS
Phone: [phone]
=80 mA
Ld
P 6 / 6
TOM2 MODEL PARAMETERS
Parameters
VTO
ALPHA
BETA
GAMMA
DELTA
Q
NG
ND
TAU
RG
RD
RS
IS
N
VBI
VDELTA
-0.43283 V
0.0416
0.3091
2.0833 Ohm
1E-11 mA
5.558 ps
1.358 Ohm
1.662 Ohm
Fax: [phone]
9.54
0.49
0.84
0.01
0.1
0.2 V
1
1 V
5 C; Handling Tool:
Parameters
VMAX
CGD
CGS
CDS
RIS
RID
VBR
RDB
CBS
TNOM
LS
LG
LD
AFAC
NFING
REV.2_04/12/2004
0.01893 nH
0.0554 pF
0.1599 pF
94.333 Ohm
0.0463 pF
0.0576 nH
6.018 pF
5.755 Ohm
0.001 Ohm
0.038 nH
0.5 V
25 C
9 V
1
1