MMFT2N02EL Motorola, MMFT2N02EL Datasheet
MMFT2N02EL
Related parts for MMFT2N02EL
MMFT2N02EL Summary of contents
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... The Formed Leads Absorb Thermal Stress During Sol- dering, Eliminating the Possibility of Damage to the Die Available Tape and Reel Use MMFT2N02ELT1 to order the 7 inch/1000 unit reel. Use MMFT2N02ELT3 to order the 13 inch/4000 unit reel. MAXIMUM RATINGS ( unless otherwise noted) Rating Drain– ...
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... MMFT2N02EL ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage 250 A) Zero Gate Voltage Drain Current Gate–Body Leakage Current CHARACTERISTICS Gate Threshold Voltage mA) Static Drain– ...
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... Figure 4. On–Resistance versus Drain Current 0 1.6 A 0.4 0.3 0.2 0 – JUNCTION TEMPERATURE ( C) Figure 6. On–Resistance versus Junction MMFT2N02EL 100 150 JUNCTION TEMP ( C) With Temperature 100 – ...
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... MMFT2N02EL FORWARD BIASED SAFE OPERATING AREA The FBSOA curves define the maximum drain–to–source voltage and drain current that a device can safely handle when it is forward biased, or when it is on, or being turned on. Because these curves include the limitations of simultaneous high voltage and high current the rating of the device, they are especially useful to designers of linear systems ...
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... MAX. CSOA STRESS AREA Figure 9. Commutating Waveforms – Figure 11. Commutating Safe Operating Area BV DSS Figure 13. Unclamped Inductive Switching MMFT2N02EL R GS DUT – 80% OF RATED V DSS V dsL = /dt Test Circuit ...
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... MMFT2N02EL 1800 1600 1400 1200 1000 800 600 400 200 Figure 15. Gate Charge versus Gate–To–Source Voltage 100 PULSE WIDTH 100 s, DUTY CYCLE 10 iss C oss ...
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... Area for the SOT–223 Package (Typical) Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. MMFT2N02EL 0.8 Watts 1.25 Watts* 1.5 Watts ...
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... MMFT2N02EL Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure ...
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... H Motorola TMOS Power MOSFET Transistor Device Data PACKAGE DIMENSIONS CASE 318E–04 TO–261AA SOT–223 ISSUE H MMFT2N02EL NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.249 0.263 6 ...
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... JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 *MMFT2N02EL/D* Motorola TMOS Power MOSFET Transistor Device Data MMFT2N02EL/D ...