UPD16814 NEC, UPD16814 Datasheet - Page 10

• Manufacturer Part Number: UPD16814
• Description: MONOLITHIC DUAL H BRIDGE DRIVER CIRCUIT
• Manufacturer: NEC

RECOMMENDED SOLDERING CONDITIONS
Mounting Technology Manual” (C10535E).
Surface Mount Type
10
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
It is recommended to solder this product under the conditions shown below.
For soldering methods and conditions other than those listed below, consult NEC.
For details of the recommended soldering conditions, refer to Information Document “Semiconductor Device
Caution Do not use two or more soldering methods in combination (except partial heating).
Package peak temperature: 235 C, Time: 30 seconds MAX. (210 C MIN.)
Number of times: 2 MAX.
<Precautions>
(1) Start the second reflow after the device temperature rise due to the first
(2) Do not clean flux with water after the first reflow.
Package peak temperature: 215 C, Time: 40 seconds MAX. (200 C MIN.)
Number of times: 2 MAX.
<Precautions>
(1) Start the second reflow after the device temperature rise due to the first
(2) Do not clean flux with water after the first reflow.
Soldering bath temperature: 260 C MAX., Time: 10 seconds MAX.,
Number of times: 1
Preheating temperature: 120 C MAX. (package surface temperature)
Pin temperature: 300 C MAX., Time: 3 seconds MAX. (per side of device)
reflow has dropped to room temperature.
reflow has dropped to room temperature.
Soldering Condition
Symbol of Recommended
Soldering
WS60-00-1
VP15-00-2
IR35-00-2
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PD16814