UPD75P308 NEC, UPD75P308 Datasheet - Page 30

• Manufacturer Part Number: UPD75P308
• Description: 4-BIT SINGLE-CHIP MICROCOMPUTER
• Manufacturer: NEC

30
6. RECOMMENDED SOLDERING CONDITIONS
Devices Mounting Manual" (IEI-616).
*: Number of days after unpacking the dry pack. Storage conditions are 25 C and 65%RH max.
Caution: Do not use two or more soldering methods in combination (except the pin partial heating
Wave Soldering
Infrared Reflow
VPS
Pin Partial Heating
It is recommended that PD75P308 be soldered under the following conditions.
For details on the recommended soldering conditions, refer to Information Document "Semiconductor
The soldering methods and conditions are not listed here, consult NEC.
Soldering Method
PD75P308GF-3B9: 80-pin plastic QFP (14 x 20 mm)
A model that can be soldered under the more stringent conditions (infrared reflow peak
temperature: 235 C, number of times: 2, and an extended number of days) is also available.
For details, consult NEC.
Notice
method).
Soldering bath temperature: 260 C max.,
time: 10 seconds max., number of times: 1,
pre-heating temperature: 120 C max. (package surface
temperature), maximum number of days: 2 days*,
(beyond this period, 16 hours of pre-baking is required
at 125 C).
Package peak temperature: 230 C,
time: 30 seconds max. (210 C min.),
number of times: 1, maximum number of days: 2 days*
(beyond this period, 16 hours of pre-baking is required
at 125 C)
Package peak temperature: 215 C,
time: 40 seconds max. (200 C min.),
number of times: 1, maximum number of days: 2 days*
(beyond this period, 16 hours of pre-baking is required
at 125 C)
Pin temperature: 300 C max.,
time: 3 seconds max. (per side)
Table 6-1 Soldering Conditions
Soldering Conditions
WS60-162-1
IR30-162-1
VP15-162-1
Symbol for Recommended
—
Condition
PD75P308