NTD60N02R-001 ON, NTD60N02R-001 Datasheet

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NTD60N02R-001

Manufacturer Part Number
NTD60N02R-001
Description
Power MOSFET 62 A / 24 V / N-Channel / DPAK
Manufacturer
ON
Datasheet
NTD60N02R
Power MOSFET
62 A, 24 V, N−Channel, DPAK
Features
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using 0.5 in sq drain pad size.
2. When surface mounted to an FR4 board using the minimum recommended
MAXIMUM RATINGS
December, 2004 − Rev. 10
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance
Total Power Dissipation @ T
Drain Current
Thermal Resistance
Total Power Dissipation @ T
Drain Current − Continuous @ T
Thermal Resistance
Total Power Dissipation @ T
Drain Current − Continuous @ T
Operating and Storage Temperature
Single Pulse Drain−to−Source Avalanche Energy
− Starting T
(V
I
Maximum Lead Temperature for Soldering
Purposes, 1/8 from case for 10 seconds
L
High−Efficiency DC−DC Converters
Planar HD3e Process for Fast Switching Performance
Low R
Low C
Low Gate Charge
Optimized for High Side Switching Requirements in
Pb−Free Packages are Available
Semiconductor Components Industries, LLC, 2004
pad size.
DD
= 11 Apk, L = 1.0 mH, R
Junction−to−Case
Continuous @ T
Continuous @ T
Continuous @ T
Junction−to−Ambient (Note 1)
Junction−to−Ambient (Note 2)
= 50 Vdc, V
DS(on)
iss
J
to Minimize Driver Loss
= 25 C
to Minimize Conduction Loss
GS
A
C
C
= 10.0 Vdc,
Rating
= 25 C, Limited by Wires
= 25 C, Chip
= 25 C, Limited by Package
(T
J
G
= 25 C unless otherwise noted)
A
A
= 25 W)
C
= 25 C
= 25 C
= 25 C
A
A
= 25 C
= 25 C
Symbol
T
V
R
R
R
J
V
E
T
P
P
P
, and
T
DSS
qJC
I
I
I
I
I
qJA
qJA
stg
GS
AS
D
D
D
D
D
D
D
D
L
−55 to
Value
1.87
10.5
1.25
120
175
260
2.6
8.5
24
58
62
50
32
80
60
20
1
Unit
C/W
Vdc
Vdc
C/W
C/W
mJ
W
W
W
A
A
A
A
A
C
C
(Surface Mount)
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
1 2
CASE 369AA
V
Gate
STYLE 2
(BR)DSS
24 V
3
DPAK
1
Drain
Drain
ORDERING INFORMATION
4
2
4
Y
WW
60N02R = Device Code
G
& PIN ASSIGNMENTS
MARKING DIAGRAM
http://onsemi.com
3
Source
8.4 mW @ 10 V
(Surface Mount)
1 2
R
N−Channel
CASE 369C
DS(on)
= Year
= Work Week
STYLE 2
DPAK
D
3
Publication Order Number:
TYP
S
4
Gate
1
Drain
Drain
NTD60N02R/D
(Straight Lead)
4
2
CASE 369D
STYLE 2
I
1
D
DPAK
62 A
3
Source
2
MAX
3
4

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NTD60N02R-001 Summary of contents

Page 1

... CASE 369C CASE 369D DPAK DPAK (Surface Mount) (Straight Lead) STYLE 2 STYLE 2 MARKING DIAGRAM & PIN ASSIGNMENTS 4 Drain Source Gate Drain Source Y = Year WW = Work Week 60N02R = Device Code Publication Order Number: NTD60N02R/D ...

Page 2

... Forward On−Voltage ( Adc Reverse Recovery Time Reverse Recovery Stored Charge 3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%. 4. Switching characteristics are independent of operating junction temperatures. NTD60N02R ( unless otherwise noted) J Symbol Vdc Adc) (Note ...

Page 3

... Gate−to−Source Voltage 2 1.8 GS 1.6 1.4 1.2 1.0 0.8 0.6 −50 − JUNCTION TEMPERATURE ( C) J Figure 5. On−Resistance Variation with Temperature NTD60N02R TYPICAL CHARACTERISTICS 120 5.0 V 100 4 175 2 Figure 2. Transfer Characteristics ...

Page 4

... R , GATE RESISTANCE (W) G Figure 9. Resistive Switching Time Variation versus Gate Resistance 100 V GS SINGLE PULSE 0.1 Figure 11. Maximum Rated Forward Biased Safe Operating Area NTD60N02R iss oss 1 C rss ...

Page 5

... ORDERING INFORMATION Order Number NTD60N02R NTD60N02RG NTD60N02RT4 NTD60N02RT4G NTD60N02R−001 NTD60N02R−1G NTD60N02R−032 NTD60N02R−032G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifi- cations Brochure, BRD8011/D. NTD60N02R P (pk) t ...

Page 6

... 0.13 (0.005 5.80 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NTD60N02R PACKAGE DIMENSIONS DPAK CASE 369C−01 ISSUE O SEATING −T− PLANE SOLDERING FOOTPRINT* 6 ...

Page 7

... 0.13 (0.005) M 5.80 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NTD60N02R PACKAGE DIMENSIONS DPAK CASE 369AA−01 ISSUE O SEATING −T− PLANE SOLDERING FOOTPRINT* 6 ...

Page 8

... K 0.350 0.380 8.89 9.65 R 0.180 0.215 4.45 5.45 S 0.025 0.040 0.63 1.01 V 0.035 0.050 0.89 1.27 Z 0.155 −−− 3.93 −−− STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NTD60N02R/D ...

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