NE34018 NEC, NE34018 Datasheet - Page 14

• Manufacturer Part Number: NE34018
• Description: L to S BAND LOW NOISE AMPLIFIER N-CHANNEL HJ-FET
• Manufacturer: NEC

RECOMMENDED SOLDERING CONDITIONS
different conditions.
<TYPES OF SURFACE MOUNT DEVICE>
(C10535E).
14
VPS
Wave soldering
Infrared ray reflow
Partial heating method
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
*
Note Do not apply more than a single process at once, except for “Partial heating method”.
PRECAUTION
Soldering process
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 qC and relative humidity at 65 % or less.
Avoid high static voltage and electric fields, because this device is Hetero Junction
field effect transistor with shottky barrier gate.
Package peak temperature: 215 qC,
Time: 40 seconds MAX. (200 qC MIN.),
Number of times: 3, Number of days: not limited*
Soldering bath temperature: 260 qC MAX.,
Time: 10 seconds MAX., Number of times: 1,
Number of days: not limited*
Peak package’s surface temperature: 230 qC below,
Reflow time: 30 seconds or below (210 qC or higher),
Number of reflow process: 3, Exposure limit*: None
Terminal temperature: 230 qC or below,
Flow time: 10 seconds or below, Exposure limit*: None
Soldering conditions
WS60-00-1
VP15-00-3
IR30-00-3
Symbol
NE34018